Optimization of the tip of microwave AFM probe

Yang Ju; Motohiro Hamada; Atsushi Hosoi; Akifumi Fujimoto

doi:10.1115/InterPACK2009-89252

Optimization of the tip of microwave AFM probe

Yang Ju, Motohiro Hamada, Atsushi Hosoi, Akifumi Fujimoto

School of Fundamental Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In order to develop a new structure microwave probe, the fabrication of the atomic force microscope (AFM) probe on a GaAs wafer was studied. The fabricated probe had a tip of 8 μ m high and curvature radius approximately 30 nm. The dimensions of the cantilever are 250x30x15 μm. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. The open structure of the waveguide at the tip of the probe was introduced by using focused ion beam (FIB) fabrication. To improve the resolution of AFM measurement, only the metal film was removed at the end of the probe tip. AFM topography of a grating sample was measured by the fabricated probe. As a result, it was found that the resolution of AFM measurement and the ratio of signal to noise were enhanced.

Original language	English
Title of host publication	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Pages	485-490
Number of pages	6
DOIs	https://doi.org/10.1115/InterPACK2009-89252
Publication status	Published - 2010 Jun 25
Event	2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States Duration: 2009 Jul 19 → 2009 Jul 23

Publication series

Name	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Volume	1

Conference

Conference	2009 ASME InterPack Conference, IPACK2009
Country	United States
City	San Francisco, CA
Period	09/7/19 → 09/7/23

Fingerprint

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Ju, Y., Hamada, M., Hosoi, A., & Fujimoto, A. (2010). Optimization of the tip of microwave AFM probe. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 485-490). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 1). https://doi.org/10.1115/InterPACK2009-89252

Ju, Y, Hamada, M, Hosoi, A & Fujimoto, A 2010, Optimization of the tip of microwave AFM probe. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. Proceedings of the ASME InterPack Conference 2009, IPACK2009, vol. 1, pp. 485-490, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 09/7/19. https://doi.org/10.1115/InterPACK2009-89252

@inproceedings{dfbbb072ba3b4ea2a251c46e70487159,

title = "Optimization of the tip of microwave AFM probe",

abstract = "In order to develop a new structure microwave probe, the fabrication of the atomic force microscope (AFM) probe on a GaAs wafer was studied. The fabricated probe had a tip of 8 μ m high and curvature radius approximately 30 nm. The dimensions of the cantilever are 250x30x15 μm. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. The open structure of the waveguide at the tip of the probe was introduced by using focused ion beam (FIB) fabrication. To improve the resolution of AFM measurement, only the metal film was removed at the end of the probe tip. AFM topography of a grating sample was measured by the fabricated probe. As a result, it was found that the resolution of AFM measurement and the ratio of signal to noise were enhanced.",

author = "Yang Ju and Motohiro Hamada and Atsushi Hosoi and Akifumi Fujimoto",

year = "2010",

month = jun,

day = "25",

doi = "10.1115/InterPACK2009-89252",

language = "English",

isbn = "9780791843598",

series = "Proceedings of the ASME InterPack Conference 2009, IPACK2009",

pages = "485--490",

booktitle = "Proceedings of the ASME InterPack Conference 2009, IPACK2009",

note = "2009 ASME InterPack Conference, IPACK2009 ; Conference date: 19-07-2009 Through 23-07-2009",

}

TY - GEN

T1 - Optimization of the tip of microwave AFM probe

AU - Ju, Yang

AU - Hamada, Motohiro

AU - Hosoi, Atsushi

AU - Fujimoto, Akifumi

PY - 2010/6/25

Y1 - 2010/6/25

N2 - In order to develop a new structure microwave probe, the fabrication of the atomic force microscope (AFM) probe on a GaAs wafer was studied. The fabricated probe had a tip of 8 μ m high and curvature radius approximately 30 nm. The dimensions of the cantilever are 250x30x15 μm. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. The open structure of the waveguide at the tip of the probe was introduced by using focused ion beam (FIB) fabrication. To improve the resolution of AFM measurement, only the metal film was removed at the end of the probe tip. AFM topography of a grating sample was measured by the fabricated probe. As a result, it was found that the resolution of AFM measurement and the ratio of signal to noise were enhanced.

AB - In order to develop a new structure microwave probe, the fabrication of the atomic force microscope (AFM) probe on a GaAs wafer was studied. The fabricated probe had a tip of 8 μ m high and curvature radius approximately 30 nm. The dimensions of the cantilever are 250x30x15 μm. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. The open structure of the waveguide at the tip of the probe was introduced by using focused ion beam (FIB) fabrication. To improve the resolution of AFM measurement, only the metal film was removed at the end of the probe tip. AFM topography of a grating sample was measured by the fabricated probe. As a result, it was found that the resolution of AFM measurement and the ratio of signal to noise were enhanced.

UR - http://www.scopus.com/inward/record.url?scp=77953743242&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77953743242&partnerID=8YFLogxK

U2 - 10.1115/InterPACK2009-89252

DO - 10.1115/InterPACK2009-89252

M3 - Conference contribution

AN - SCOPUS:77953743242

SN - 9780791843598

T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009

SP - 485

EP - 490

BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009

T2 - 2009 ASME InterPack Conference, IPACK2009

Y2 - 19 July 2009 through 23 July 2009

ER -

Access to Document

10.1115/InterPACK2009-89252