Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate

Manabu Tanaka, Naonobu Shimamoto, Takashi Tanii, Iwao Ohdomari, Hiroyuki Nishide

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

The packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns were achieved using silicon-microfabricated substrates and a simple dipping and pulling-up process. The polystyrene particles were selectively deposited within the micrometer-sized square, triangular, or circular recessed patterns by tuning the experimental conditions during the pulling-up process. The process produced a capillary force, i.e., a gas-liquid interfacial tension, to push the particles into the recessed patterns on the substrate. In most cases, the selectively depositing particles within the recessed patterns self-organically formed the closest packing structures. However, a special phenomenon, cubic packing structures of the particles, was observed when using square patterns with a few times larger side-length than the particle diameters. Several particle packing structures within different-sized square patterns were demonstrated, and the relationship between the particle packing structures and square pattern sizes were discussed.

Original languageEnglish
Pages (from-to)451-455
Number of pages5
JournalScience and Technology of Advanced Materials
Volume7
Issue number5
DOIs
Publication statusPublished - 2006 Jul

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Polystyrenes
Silicon
Substrates
Surface tension
Tuning
Gases
Liquids

Keywords

  • Capillary force
  • Cubic packing
  • Hexagonal closest packing
  • Polystyrene particle
  • Self-assembly
  • Silicon-microfabricated substrate

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate. / Tanaka, Manabu; Shimamoto, Naonobu; Tanii, Takashi; Ohdomari, Iwao; Nishide, Hiroyuki.

In: Science and Technology of Advanced Materials, Vol. 7, No. 5, 07.2006, p. 451-455.

Research output: Contribution to journalArticle

@article{9c7f1bd9bf2541d2b4e0fe0c2c6f8ab3,
title = "Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate",
abstract = "The packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns were achieved using silicon-microfabricated substrates and a simple dipping and pulling-up process. The polystyrene particles were selectively deposited within the micrometer-sized square, triangular, or circular recessed patterns by tuning the experimental conditions during the pulling-up process. The process produced a capillary force, i.e., a gas-liquid interfacial tension, to push the particles into the recessed patterns on the substrate. In most cases, the selectively depositing particles within the recessed patterns self-organically formed the closest packing structures. However, a special phenomenon, cubic packing structures of the particles, was observed when using square patterns with a few times larger side-length than the particle diameters. Several particle packing structures within different-sized square patterns were demonstrated, and the relationship between the particle packing structures and square pattern sizes were discussed.",
keywords = "Capillary force, Cubic packing, Hexagonal closest packing, Polystyrene particle, Self-assembly, Silicon-microfabricated substrate",
author = "Manabu Tanaka and Naonobu Shimamoto and Takashi Tanii and Iwao Ohdomari and Hiroyuki Nishide",
year = "2006",
month = "7",
doi = "10.1016/j.stam.2006.04.003",
language = "English",
volume = "7",
pages = "451--455",
journal = "Science and Technology of Advanced Materials",
issn = "1468-6996",
publisher = "IOP Publishing Ltd.",
number = "5",

}

TY - JOUR

T1 - Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate

AU - Tanaka, Manabu

AU - Shimamoto, Naonobu

AU - Tanii, Takashi

AU - Ohdomari, Iwao

AU - Nishide, Hiroyuki

PY - 2006/7

Y1 - 2006/7

N2 - The packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns were achieved using silicon-microfabricated substrates and a simple dipping and pulling-up process. The polystyrene particles were selectively deposited within the micrometer-sized square, triangular, or circular recessed patterns by tuning the experimental conditions during the pulling-up process. The process produced a capillary force, i.e., a gas-liquid interfacial tension, to push the particles into the recessed patterns on the substrate. In most cases, the selectively depositing particles within the recessed patterns self-organically formed the closest packing structures. However, a special phenomenon, cubic packing structures of the particles, was observed when using square patterns with a few times larger side-length than the particle diameters. Several particle packing structures within different-sized square patterns were demonstrated, and the relationship between the particle packing structures and square pattern sizes were discussed.

AB - The packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns were achieved using silicon-microfabricated substrates and a simple dipping and pulling-up process. The polystyrene particles were selectively deposited within the micrometer-sized square, triangular, or circular recessed patterns by tuning the experimental conditions during the pulling-up process. The process produced a capillary force, i.e., a gas-liquid interfacial tension, to push the particles into the recessed patterns on the substrate. In most cases, the selectively depositing particles within the recessed patterns self-organically formed the closest packing structures. However, a special phenomenon, cubic packing structures of the particles, was observed when using square patterns with a few times larger side-length than the particle diameters. Several particle packing structures within different-sized square patterns were demonstrated, and the relationship between the particle packing structures and square pattern sizes were discussed.

KW - Capillary force

KW - Cubic packing

KW - Hexagonal closest packing

KW - Polystyrene particle

KW - Self-assembly

KW - Silicon-microfabricated substrate

UR - http://www.scopus.com/inward/record.url?scp=33747151907&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33747151907&partnerID=8YFLogxK

U2 - 10.1016/j.stam.2006.04.003

DO - 10.1016/j.stam.2006.04.003

M3 - Article

VL - 7

SP - 451

EP - 455

JO - Science and Technology of Advanced Materials

JF - Science and Technology of Advanced Materials

SN - 1468-6996

IS - 5

ER -