Performance of 5G waveform and multiple radio access technique over a fiber-wireless fronthaul

Pham Tien Dat, Atsushi Kamio, Naokatsu Yamamoto, Tetsuya Kawanishi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    In this paper, we investigate the performance of OFDM and FBMC signals after being transmitted over a seamless fiber-wireless fronthaul system. We also examine the performance of OFDM signals using different multiple radio access techniques after being transmitted over the seamless system. We confirm that the fronthaul system has significant impacts on the performance of the signal waveforms and multiple access techniques. A cooperation between radio access and mobile transport networks should be considered to increase the operation efficiency and signal performance.

    Original languageEnglish
    Title of host publicationMWP 2017 - 2017 International Topical Meeting on Microwave Photonics
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1-3
    Number of pages3
    Volume2017-December
    ISBN (Electronic)9781538607626
    DOIs
    Publication statusPublished - 2017 Dec 5
    Event2017 International Topical Meeting on Microwave Photonics, MWP 2017 - Beijing, China
    Duration: 2017 Oct 232017 Oct 26

    Other

    Other2017 International Topical Meeting on Microwave Photonics, MWP 2017
    CountryChina
    CityBeijing
    Period17/10/2317/10/26

    Keywords

    • 5G waveform
    • Mobile fronthaul
    • Multiple radio accesisi technique
    • Radio-over-fiber
    • Seamless fiber-wireless

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Atomic and Molecular Physics, and Optics

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  • Cite this

    Dat, P. T., Kamio, A., Yamamoto, N., & Kawanishi, T. (2017). Performance of 5G waveform and multiple radio access technique over a fiber-wireless fronthaul. In MWP 2017 - 2017 International Topical Meeting on Microwave Photonics (Vol. 2017-December, pp. 1-3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWP.2017.8168697