Plate-laminated corporate-feed slotted waveguide array antenna at 350-GHz band by silicon process

Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to ±20μm. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about ±5 μm using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, an antenna prototype has been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 44.6 GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

Original languageEnglish
Title of host publicationISAP 2016 - International Symposium on Antennas and Propagation
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages538-539
Number of pages2
ISBN (Electronic)9784885523137
Publication statusPublished - 2017 Jan 17
Event21st International Symposium on Antennas and Propagation, ISAP 2016 - Ginowan, Okinawa, Japan
Duration: 2016 Oct 242016 Oct 28

Publication series

NameISAP 2016 - International Symposium on Antennas and Propagation

Other

Other21st International Symposium on Antennas and Propagation, ISAP 2016
CountryJapan
CityGinowan, Okinawa
Period16/10/2416/10/28

Keywords

  • Corporate feed waveguide
  • DRIE (deep reactive ion etcher)
  • Diffusion bonding process
  • Silicon process
  • Slotted waveguide array
  • Submillimeter wave antennas

ASJC Scopus subject areas

  • Radiation
  • Computer Networks and Communications
  • Instrumentation

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