Plating Technologies

Takayuki Homma*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)
Original languageEnglish
Pages (from-to)616-624
Number of pages9
JournalJournal of Japan Institute of Electronics Packaging
Volume6
Issue number7
DOIs
Publication statusPublished - 2003

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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