Plating Technologies

    Research output: Contribution to journalArticle

    1 Citation (Scopus)
    Original languageEnglish
    Pages (from-to)616-624
    Number of pages9
    JournalJournal of Japan Institute of Electronics Packaging
    Volume6
    Issue number7
    DOIs
    Publication statusPublished - 2003 Jan 1

    Fingerprint

    Plating

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Plating Technologies. / Homma, Takayuki.

    In: Journal of Japan Institute of Electronics Packaging, Vol. 6, No. 7, 01.01.2003, p. 616-624.

    Research output: Contribution to journalArticle

    @article{b1c89114a3fc4b3ea648802aa7aad38a,
    title = "Plating Technologies",
    author = "Takayuki Homma",
    year = "2003",
    month = "1",
    day = "1",
    doi = "10.5104/jiep.6.616",
    language = "English",
    volume = "6",
    pages = "616--624",
    journal = "Journal of Japan Institute of Electronics Packaging",
    issn = "1343-9677",
    publisher = "The Japan Institute of Electronics Packaging",
    number = "7",

    }

    TY - JOUR

    T1 - Plating Technologies

    AU - Homma, Takayuki

    PY - 2003/1/1

    Y1 - 2003/1/1

    UR - http://www.scopus.com/inward/record.url?scp=85021658702&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=85021658702&partnerID=8YFLogxK

    U2 - 10.5104/jiep.6.616

    DO - 10.5104/jiep.6.616

    M3 - Article

    AN - SCOPUS:85021658702

    VL - 6

    SP - 616

    EP - 624

    JO - Journal of Japan Institute of Electronics Packaging

    JF - Journal of Japan Institute of Electronics Packaging

    SN - 1343-9677

    IS - 7

    ER -