Poly(2-diphenylamino-1,4-phenylenevinylene): Its preparation via chemical vapor deposition polymerization

Yusuke Takahashi, Takashi Kurata, Hiroyuki Nishide, Chun Young Lee, Eui Doo Do, Jung Il Jin

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

2,5-Bis(chloromethyl)triphenylamine 1 was prepared and polymerized via the Gilch reaction to give poly(2-diphenylamino-1,4-phenylenevinylene) 2G as a solvent-soluble Φ-conjugated polymer. 1 was also polymerized via the chemical vapor deposition to yield the precursor polymer of 2C, which was heated under vacuum to yield a yellow or brown thin film of 2C on substrates such as glass and a silicon wafer. Spectroscopies of the film supported the formation of the poly (2-diphenylamino-1,4-phenylenevinylene) 2C. The arylamine moiety of the 2C film worked as a functional group like a redox site.

Original languageEnglish
Pages (from-to)475-480
Number of pages6
JournalScience and Technology of Advanced Materials
Volume7
Issue number5
DOIs
Publication statusPublished - 2006 Jul

Fingerprint

Chemical vapor deposition
Polymerization
Conjugated polymers
Silicon wafers
Functional groups
Polymers
Spectroscopy
Vacuum
Glass
Thin films
Substrates
Oxidation-Reduction

Keywords

  • Carbonization
  • Chemical vapor deposition polymerization
  • Poly(phenylenevinylene)
  • Triphenylamine

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Poly(2-diphenylamino-1,4-phenylenevinylene) : Its preparation via chemical vapor deposition polymerization. / Takahashi, Yusuke; Kurata, Takashi; Nishide, Hiroyuki; Lee, Chun Young; Do, Eui Doo; Jin, Jung Il.

In: Science and Technology of Advanced Materials, Vol. 7, No. 5, 07.2006, p. 475-480.

Research output: Contribution to journalArticle

Takahashi, Yusuke ; Kurata, Takashi ; Nishide, Hiroyuki ; Lee, Chun Young ; Do, Eui Doo ; Jin, Jung Il. / Poly(2-diphenylamino-1,4-phenylenevinylene) : Its preparation via chemical vapor deposition polymerization. In: Science and Technology of Advanced Materials. 2006 ; Vol. 7, No. 5. pp. 475-480.
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