Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding

T. Suzuki, F. Kitagawa, H. Shinohara, Jun Mizuno, K. Otsuka, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (∼0.1 μL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.

Original languageEnglish
Title of host publicationTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages1617-1620
Number of pages4
DOIs
Publication statusPublished - 2007
Event4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 - Lyon
Duration: 2007 Jun 102007 Jun 14

Other

Other4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07
CityLyon
Period07/6/1007/6/14

Fingerprint

Electrophoresis
Mass spectrometry
Polymers
Electrospray ionization
Temperature
Flow rate
Pumps
Costs

Keywords

  • COP
  • Electrospray ionization
  • Hot embossing
  • Low temperature direct bonding

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Suzuki, T., Kitagawa, F., Shinohara, H., Mizuno, J., Otsuka, K., & Shoji, S. (2007). Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 1617-1620). [4300458] https://doi.org/10.1109/SENSOR.2007.4300458

Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding. / Suzuki, T.; Kitagawa, F.; Shinohara, H.; Mizuno, Jun; Otsuka, K.; Shoji, Shuichi.

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 1617-1620 4300458.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Suzuki, T, Kitagawa, F, Shinohara, H, Mizuno, J, Otsuka, K & Shoji, S 2007, Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding. in TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems., 4300458, pp. 1617-1620, 4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07, Lyon, 07/6/10. https://doi.org/10.1109/SENSOR.2007.4300458
Suzuki T, Kitagawa F, Shinohara H, Mizuno J, Otsuka K, Shoji S. Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 1617-1620. 4300458 https://doi.org/10.1109/SENSOR.2007.4300458
Suzuki, T. ; Kitagawa, F. ; Shinohara, H. ; Mizuno, Jun ; Otsuka, K. ; Shoji, Shuichi. / Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding. TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. pp. 1617-1620
@inproceedings{e4a35f5b64e14ab68af692b20fa1b0f1,
title = "Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding",
abstract = "Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (∼0.1 μL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.",
keywords = "COP, Electrospray ionization, Hot embossing, Low temperature direct bonding",
author = "T. Suzuki and F. Kitagawa and H. Shinohara and Jun Mizuno and K. Otsuka and Shuichi Shoji",
year = "2007",
doi = "10.1109/SENSOR.2007.4300458",
language = "English",
isbn = "1424408423",
pages = "1617--1620",
booktitle = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",

}

TY - GEN

T1 - Polymer microchip for electrophoresis-mass spectrometry fabricated by hot embossing and low temperature direct bonding

AU - Suzuki, T.

AU - Kitagawa, F.

AU - Shinohara, H.

AU - Mizuno, Jun

AU - Otsuka, K.

AU - Shoji, Shuichi

PY - 2007

Y1 - 2007

N2 - Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (∼0.1 μL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.

AB - Integrated electrophoresis-mass spectrometry polymer devices were fabricated. The electrospray ionization (ESI) emitter tip structure was formed directly at the microchip electrophoresis (MCE) outlet. Since these devices enable negligible dead volume at the electrospray port, efficient spray of the sample necessary for high resolution mass spectrometry (MS) was realized. Stable spray was also achieved at the low flow rate (∼0.1 μL/min) without additional pump. Low cost and high performance COP MCE-MS chip was fabricated by hot embossing and low temperature direct bonding.

KW - COP

KW - Electrospray ionization

KW - Hot embossing

KW - Low temperature direct bonding

UR - http://www.scopus.com/inward/record.url?scp=50049086620&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50049086620&partnerID=8YFLogxK

U2 - 10.1109/SENSOR.2007.4300458

DO - 10.1109/SENSOR.2007.4300458

M3 - Conference contribution

SN - 1424408423

SN - 9781424408429

SP - 1617

EP - 1620

BT - TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

ER -