Possible mechanism of superior Partial-discharge resistance of polyamide nanocomposites

Norikazu Fuse, M. Kozako, T. Tanaka, S. Murase, Yoshimichi Ohki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    44 Citations (Scopus)

    Abstract

    The dielectric properties of polyamide nanocomposites were examined, focusing especially on their resistance against partial discharges. The present paper compares the surface roughness caused by partial discharges and that caused by exposure to plasmas, between polyamide with and without inorganic nanofillers. From X-ray diffraction spectroscopy, it was confirmed that the nanofillers are rearranged in parallel with their surfaces with a mutual distance around 1 nm after the nanocomposite was subjected to partial discharges. Such ordered arrangement of nanofillers should contribute to the high durability against partial discharges in polyamide nanocomposites, in addition to the effects of the presence of mica, high crystallinity, and strong ionic interaction at mica/resin interfaces. Furthermore, the result of a preliminary attempt done to detect the structural change through observation of photoluminescence spectra is also reported.

    Original languageEnglish
    Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    Pages322-325
    Number of pages4
    Publication statusPublished - 2004
    Event2004 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Boulder, CO, United States
    Duration: 2004 Oct 172004 Oct 20

    Other

    Other2004 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    CountryUnited States
    CityBoulder, CO
    Period04/10/1704/10/20

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    ASJC Scopus subject areas

    • Engineering(all)

    Cite this

    Fuse, N., Kozako, M., Tanaka, T., Murase, S., & Ohki, Y. (2004). Possible mechanism of superior Partial-discharge resistance of polyamide nanocomposites. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 322-325)