Post-hydrophilic treatment free plastic biochip fabrication method using polyurea film

H. Shinohara, Y. Takahashi, J. Mizuno, S. Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A novel low temperature bonding method was developed by using polyurea film as intermediate layers. A microchip having microchannel which has highly hydrophilic surface was realized by the pretreatment of VUV (vacuum ultraviolet) light irradiation. The bonding temperature was low enough to use thermo plastic channel plates such as PMMA (poly-methyl methacrylate) with negligible deformation of the channel structure. The results of contact angle measurements indicate that the highly hydrophilic surface of the microchannel was kept after the bonding process. For actual micro biochip fabrication, the post-hydrophilic treatment after bonding process can be skipped.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages367-370
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Shinohara, H., Takahashi, Y., Mizuno, J., & Shoji, S. (2008). Post-hydrophilic treatment free plastic biochip fabrication method using polyurea film. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 367-370). [4443669] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443669