Potential-dependent surface morphology and microtexture evolution of electrodeposited copper films

Two distinct morphologies were observed for copper films electrodeposited from an organic additive-free acid sulphate electrolyte near the limiting current density, namely facetted columns and spheroidal nodules. Facetted columns form for overpotentials 200-280 mV while nodules form for 240 mV. Electron Back Scattering Diffraction (EBSD) was applied to cross-sections of the columnar films to determine the crystallographic orientation of individual grains. Over the first few microns, the substrate has a strong influence, but for greater thicknesses, the columnar film develops a strong 110 and weak 112 fibre texture.