Potential-dependent surface morphology and microtexture evolution of electrodeposited copper films

M. C. Lafouresse, Y. Fukunaka, Takayuki Homma, S. Honjo, S. Kikuchi, W. Schwarzacher

    Research output: Contribution to journalArticle

    4 Citations (Scopus)

    Abstract

    Two distinct morphologies were observed for copper films electrodeposited from an organic additive-free acid sulphate electrolyte near the limiting current density, namely facetted columns and spheroidal nodules. Facetted columns form for overpotentials 200-280 mV while nodules form for 240 mV. Electron Back Scattering Diffraction (EBSD) was applied to cross-sections of the columnar films to determine the crystallographic orientation of individual grains. Over the first few microns, the substrate has a strong influence, but for greater thicknesses, the columnar film develops a strong 110 and weak 112 fibre texture.

    Original languageEnglish
    JournalElectrochemical and Solid-State Letters
    Volume14
    Issue number7
    DOIs
    Publication statusPublished - 2011

    Fingerprint

    Surface morphology
    Copper
    nodules
    copper
    Electrolytes
    Sulfates
    sulfates
    Current density
    textures
    Textures
    Diffraction
    electrolytes
    Scattering
    current density
    acids
    Acids
    fibers
    Electrons
    Fibers
    cross sections

    ASJC Scopus subject areas

    • Electrochemistry
    • Electrical and Electronic Engineering
    • Materials Science(all)
    • Chemical Engineering(all)
    • Physical and Theoretical Chemistry

    Cite this

    Potential-dependent surface morphology and microtexture evolution of electrodeposited copper films. / Lafouresse, M. C.; Fukunaka, Y.; Homma, Takayuki; Honjo, S.; Kikuchi, S.; Schwarzacher, W.

    In: Electrochemical and Solid-State Letters, Vol. 14, No. 7, 2011.

    Research output: Contribution to journalArticle

    Lafouresse, M. C. ; Fukunaka, Y. ; Homma, Takayuki ; Honjo, S. ; Kikuchi, S. ; Schwarzacher, W. / Potential-dependent surface morphology and microtexture evolution of electrodeposited copper films. In: Electrochemical and Solid-State Letters. 2011 ; Vol. 14, No. 7.
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