Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

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26 Citations (Scopus)

Abstract

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

Original languageEnglish
Pages (from-to)882-887
Number of pages6
JournalElectrochimica Acta
Volume51
Issue number5
DOIs
Publication statusPublished - 2005 Nov 10

Fingerprint

Gold alloys
Nickel alloys
Plating
Gold Alloys
Tungsten alloys
Tungsten
Electroplating
Contact resistance
Potassium
Deposits
Gold
Hardness
Transmission electron microscopy

Keywords

  • Amorphous gold-nickel alloy
  • Contact resistance
  • Hardness
  • Nickel-tungsten alloy
  • Resistivity

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

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title = "Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications",
abstract = "A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.",
keywords = "Amorphous gold-nickel alloy, Contact resistance, Hardness, Nickel-tungsten alloy, Resistivity",
author = "Norihiro Togasaki and Yutaka Okinaka and Takayuki Homma and Tetsuya Osaka",
year = "2005",
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T1 - Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

AU - Togasaki, Norihiro

AU - Okinaka, Yutaka

AU - Homma, Takayuki

AU - Osaka, Tetsuya

PY - 2005/11/10

Y1 - 2005/11/10

N2 - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

AB - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

KW - Amorphous gold-nickel alloy

KW - Contact resistance

KW - Hardness

KW - Nickel-tungsten alloy

KW - Resistivity

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