Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Norihiro Togasaki; Yutaka Okinaka; Takayuki Homma; Tetsuya Osaka

doi:10.1016/j.electacta.2005.04.057

Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Norihiro Togasaki, Yutaka Okinaka, Takayuki Homma, Tetsuya Osaka^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

33 Citations (Scopus)

Abstract

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

Original language	English
Pages (from-to)	882-887
Number of pages	6
Journal	Electrochimica Acta
Volume	51
Issue number	5
DOIs	https://doi.org/10.1016/j.electacta.2005.04.057
Publication status	Published - 2005 Nov 10

Keywords

Amorphous gold-nickel alloy
Contact resistance
Hardness
Nickel-tungsten alloy
Resistivity

ASJC Scopus subject areas

Chemical Engineering(all)
Electrochemistry

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10.1016/j.electacta.2005.04.057

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@article{8f23d9609a704e76933ceb6011057b9f,

title = "Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications",

abstract = "A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.",

keywords = "Amorphous gold-nickel alloy, Contact resistance, Hardness, Nickel-tungsten alloy, Resistivity",

author = "Norihiro Togasaki and Yutaka Okinaka and Takayuki Homma and Tetsuya Osaka",

year = "2005",

month = nov,

day = "10",

doi = "10.1016/j.electacta.2005.04.057",

language = "English",

volume = "51",

pages = "882--887",

journal = "Electrochimica Acta",

issn = "0013-4686",

publisher = "Elsevier Limited",

number = "5",

}

TY - JOUR

T1 - Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

AU - Togasaki, Norihiro

AU - Okinaka, Yutaka

AU - Homma, Takayuki

AU - Osaka, Tetsuya

PY - 2005/11/10

Y1 - 2005/11/10

N2 - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

AB - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

KW - Amorphous gold-nickel alloy

KW - Contact resistance

KW - Hardness

KW - Nickel-tungsten alloy

KW - Resistivity

UR - http://www.scopus.com/inward/record.url?scp=27644516486&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=27644516486&partnerID=8YFLogxK

U2 - 10.1016/j.electacta.2005.04.057

DO - 10.1016/j.electacta.2005.04.057

M3 - Article

AN - SCOPUS:27644516486

SN - 0013-4686

VL - 51

SP - 882

EP - 887

JO - Electrochimica Acta

JF - Electrochimica Acta

IS - 5

ER -

Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Abstract

Keywords

ASJC Scopus subject areas

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