Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with D-glucose and PVP

Giuseppe Granata, Aina Onoguchi, Chiharu Tokoro

Research output: Contribution to journalArticle

Abstract

Copper nanoparticles (CuNPs) for metal-metal bonding were prepared by aqueous reduction with D-glucose and polyvinylpirrolidone (PVP). Increasing the cupric concentration in the range 0.1–1.0 M resulted in a progressive increase in CuNPs size from 30 nm to 200 nm. Fourier-transform infrared spectroscopy (FTIR) revealed as the PVP groups responsible for capping were C–N and C[dbnd]O at low cupric concentration and only C[dbnd]O at higher concentration. X-ray absorption fine structure (XAFS) revealed as the reduction occurred in two steps, with a fast reduction of CuO to Cu2O and a slower reduction of Cu2O. The reaction kinetics was modeled as a series of two irreversible first order reactions based on XAFS results. LC-MS highlighted as D-glucose oxidized to gluconate, glycerate, glycolate and oxalate. Increasing the D-glucose concentration did not affect the kinetics but resulted in smaller CuNPs. The electrical resistivity of the CuNPs material sintered at 300 °C was 36 µΩ cm.

Original languageEnglish
Article number115210
JournalChemical Engineering Science
Volume209
DOIs
Publication statusPublished - 2019 Dec 14

Fingerprint

Glucose
Copper
Metals
Nanoparticles
glycolic acid
X ray absorption
Oxalates
Reaction kinetics
Fourier transform infrared spectroscopy
Kinetics

Keywords

  • Copper nanoparticles
  • D-glucose
  • Kinetics
  • PVP
  • Sintering
  • XAFS

ASJC Scopus subject areas

  • Chemistry(all)
  • Chemical Engineering(all)
  • Industrial and Manufacturing Engineering

Cite this

Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with D-glucose and PVP. / Granata, Giuseppe; Onoguchi, Aina; Tokoro, Chiharu.

In: Chemical Engineering Science, Vol. 209, 115210, 14.12.2019.

Research output: Contribution to journalArticle

@article{f3f263113f454f259f924f76e4afbeaf,
title = "Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with D-glucose and PVP",
abstract = "Copper nanoparticles (CuNPs) for metal-metal bonding were prepared by aqueous reduction with D-glucose and polyvinylpirrolidone (PVP). Increasing the cupric concentration in the range 0.1–1.0 M resulted in a progressive increase in CuNPs size from 30 nm to 200 nm. Fourier-transform infrared spectroscopy (FTIR) revealed as the PVP groups responsible for capping were C–N and C[dbnd]O at low cupric concentration and only C[dbnd]O at higher concentration. X-ray absorption fine structure (XAFS) revealed as the reduction occurred in two steps, with a fast reduction of CuO to Cu2O and a slower reduction of Cu2O. The reaction kinetics was modeled as a series of two irreversible first order reactions based on XAFS results. LC-MS highlighted as D-glucose oxidized to gluconate, glycerate, glycolate and oxalate. Increasing the D-glucose concentration did not affect the kinetics but resulted in smaller CuNPs. The electrical resistivity of the CuNPs material sintered at 300 °C was 36 µΩ cm.",
keywords = "Copper nanoparticles, D-glucose, Kinetics, PVP, Sintering, XAFS",
author = "Giuseppe Granata and Aina Onoguchi and Chiharu Tokoro",
year = "2019",
month = "12",
day = "14",
doi = "10.1016/j.ces.2019.115210",
language = "English",
volume = "209",
journal = "Chemical Engineering Science",
issn = "0009-2509",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with D-glucose and PVP

AU - Granata, Giuseppe

AU - Onoguchi, Aina

AU - Tokoro, Chiharu

PY - 2019/12/14

Y1 - 2019/12/14

N2 - Copper nanoparticles (CuNPs) for metal-metal bonding were prepared by aqueous reduction with D-glucose and polyvinylpirrolidone (PVP). Increasing the cupric concentration in the range 0.1–1.0 M resulted in a progressive increase in CuNPs size from 30 nm to 200 nm. Fourier-transform infrared spectroscopy (FTIR) revealed as the PVP groups responsible for capping were C–N and C[dbnd]O at low cupric concentration and only C[dbnd]O at higher concentration. X-ray absorption fine structure (XAFS) revealed as the reduction occurred in two steps, with a fast reduction of CuO to Cu2O and a slower reduction of Cu2O. The reaction kinetics was modeled as a series of two irreversible first order reactions based on XAFS results. LC-MS highlighted as D-glucose oxidized to gluconate, glycerate, glycolate and oxalate. Increasing the D-glucose concentration did not affect the kinetics but resulted in smaller CuNPs. The electrical resistivity of the CuNPs material sintered at 300 °C was 36 µΩ cm.

AB - Copper nanoparticles (CuNPs) for metal-metal bonding were prepared by aqueous reduction with D-glucose and polyvinylpirrolidone (PVP). Increasing the cupric concentration in the range 0.1–1.0 M resulted in a progressive increase in CuNPs size from 30 nm to 200 nm. Fourier-transform infrared spectroscopy (FTIR) revealed as the PVP groups responsible for capping were C–N and C[dbnd]O at low cupric concentration and only C[dbnd]O at higher concentration. X-ray absorption fine structure (XAFS) revealed as the reduction occurred in two steps, with a fast reduction of CuO to Cu2O and a slower reduction of Cu2O. The reaction kinetics was modeled as a series of two irreversible first order reactions based on XAFS results. LC-MS highlighted as D-glucose oxidized to gluconate, glycerate, glycolate and oxalate. Increasing the D-glucose concentration did not affect the kinetics but resulted in smaller CuNPs. The electrical resistivity of the CuNPs material sintered at 300 °C was 36 µΩ cm.

KW - Copper nanoparticles

KW - D-glucose

KW - Kinetics

KW - PVP

KW - Sintering

KW - XAFS

UR - http://www.scopus.com/inward/record.url?scp=85071979756&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85071979756&partnerID=8YFLogxK

U2 - 10.1016/j.ces.2019.115210

DO - 10.1016/j.ces.2019.115210

M3 - Article

AN - SCOPUS:85071979756

VL - 209

JO - Chemical Engineering Science

JF - Chemical Engineering Science

SN - 0009-2509

M1 - 115210

ER -