Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM

Hirokazu Ezawa, Takashi Togasaki, Tatsuo Migita, Soichi Yamashita, Masahiro Inohara, Yasuhiro Koshio, Masatoshi Fukuda, Masahiro Miyata, Kohei Tatsumi

Research output: Contribution to journalArticle

3 Citations (Scopus)

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