Prospective for deployment of 3M technologies

Yuichi Matsushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

3M technologies including space-division multiplexing (SDM) utilizing multicore/multimode fibers are extensively developed to overcome capacity crunch of optical fiber communication systems. Recent progress toward deployment of 3M technologies in Japan will be introduced.

Original languageEnglish
Title of host publicationProceedings - 2014 Summer Topicals Meeting Series, SUM 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages144-145
Number of pages2
ISBN (Print)9781479927678
DOIs
Publication statusPublished - 2014 Sep 18
Event2014 Summer Topicals Meeting Series, SUM 2014 - Montreal
Duration: 2014 Jul 142014 Jul 16

Other

Other2014 Summer Topicals Meeting Series, SUM 2014
CityMontreal
Period14/7/1414/7/16

Fingerprint

multiplexing
division
telecommunication
Japan
optical fibers
Optical fiber communication
Multimode fibers
fibers
Multiplexing
Communication systems

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Signal Processing
  • Electrical and Electronic Engineering

Cite this

Matsushima, Y. (2014). Prospective for deployment of 3M technologies. In Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014 (pp. 144-145). [6903029] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SUM.2014.81

Prospective for deployment of 3M technologies. / Matsushima, Yuichi.

Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 144-145 6903029.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsushima, Y 2014, Prospective for deployment of 3M technologies. in Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014., 6903029, Institute of Electrical and Electronics Engineers Inc., pp. 144-145, 2014 Summer Topicals Meeting Series, SUM 2014, Montreal, 14/7/14. https://doi.org/10.1109/SUM.2014.81
Matsushima Y. Prospective for deployment of 3M technologies. In Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 144-145. 6903029 https://doi.org/10.1109/SUM.2014.81
Matsushima, Yuichi. / Prospective for deployment of 3M technologies. Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 144-145
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