Prospective for deployment of 3M technologies

Yuichi Matsushima

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    3M technologies including space-division multiplexing (SDM) utilizing multicore/multimode fibers are extensively developed to overcome capacity crunch of optical fiber communication systems. Recent progress toward deployment of 3M technologies in Japan will be introduced.

    Original languageEnglish
    Title of host publicationProceedings - 2014 Summer Topicals Meeting Series, SUM 2014
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages144-145
    Number of pages2
    ISBN (Print)9781479927678
    DOIs
    Publication statusPublished - 2014 Sep 18
    Event2014 Summer Topicals Meeting Series, SUM 2014 - Montreal
    Duration: 2014 Jul 142014 Jul 16

    Other

    Other2014 Summer Topicals Meeting Series, SUM 2014
    CityMontreal
    Period14/7/1414/7/16

    Fingerprint

    multiplexing
    division
    telecommunication
    Japan
    optical fibers
    Optical fiber communication
    Multimode fibers
    fibers
    Multiplexing
    Communication systems

    ASJC Scopus subject areas

    • Atomic and Molecular Physics, and Optics
    • Electronic, Optical and Magnetic Materials
    • Signal Processing
    • Electrical and Electronic Engineering

    Cite this

    Matsushima, Y. (2014). Prospective for deployment of 3M technologies. In Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014 (pp. 144-145). [6903029] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SUM.2014.81

    Prospective for deployment of 3M technologies. / Matsushima, Yuichi.

    Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 144-145 6903029.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Matsushima, Y 2014, Prospective for deployment of 3M technologies. in Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014., 6903029, Institute of Electrical and Electronics Engineers Inc., pp. 144-145, 2014 Summer Topicals Meeting Series, SUM 2014, Montreal, 14/7/14. https://doi.org/10.1109/SUM.2014.81
    Matsushima Y. Prospective for deployment of 3M technologies. In Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 144-145. 6903029 https://doi.org/10.1109/SUM.2014.81
    Matsushima, Yuichi. / Prospective for deployment of 3M technologies. Proceedings - 2014 Summer Topicals Meeting Series, SUM 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 144-145
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