Pulse heating method for investigation of electroless Ni-P alloy film resistors

Tetsuya Osaka, Jun Kawaguchi, Hideo Sawai

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The thermal stability of electroless Ni-P alloy thin film resistors for pulse heating was investigated using the step stress test method. The resistance of electroless Ni-P resistors is decreased by pulse heating. It was confirmed by a micro x-ray diffraction analysis of the resistors after the step stress test that this resistance decrease is due to crystallization of the resistor films. The degree of crystallization can be quantitatively evaluated as the temperature coefficient of resistance of Ni-P films calculated from resistance changes during pulse heating. The step stress test is demonstrated to be an effective and quick method of determining the thermal stability of thin film resistors for pulse heating, and it also gives an evaluation of the temperature coefficient of resistance of thin film resistors.

Original languageEnglish
Pages (from-to)748-752
Number of pages5
JournalJournal of the Electrochemical Society
Volume136
Issue number3
Publication statusPublished - 1989 Mar

Fingerprint

pulse heating
resistors
Resistors
Heating
Crystallization
Thin films
Thermodynamic stability
thermal stability
thin films
crystallization
coefficients
x ray diffraction
Diffraction
X rays
Temperature
temperature
evaluation

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Pulse heating method for investigation of electroless Ni-P alloy film resistors. / Osaka, Tetsuya; Kawaguchi, Jun; Sawai, Hideo.

In: Journal of the Electrochemical Society, Vol. 136, No. 3, 03.1989, p. 748-752.

Research output: Contribution to journalArticle

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