Random walk algorithm for large thermal RC network analysis

Jun Guo; Sheqin Dong; Satoshi Goto

doi:10.1109/ASICON.2009.5351279

Random walk algorithm for large thermal RC network analysis

Jun Guo^*, Sheqin Dong, Satoshi Goto

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

Original language	English
Title of host publication	ASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC
Pages	771-774
Number of pages	4
DOIs	https://doi.org/10.1109/ASICON.2009.5351279
Publication status	Published - 2009
Event	2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha Duration: 2009 Oct 20 → 2009 Oct 23

Other

Other	2009 8th IEEE International Conference on ASIC, ASICON 2009
City	Changsha
Period	09/10/20 → 09/10/23

Keywords

Integrated circuit
Random walk
Simulation
Thermal model

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ASICON.2009.5351279

Cite this

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title = "Random walk algorithm for large thermal RC network analysis",

abstract = "The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.",

keywords = "Integrated circuit, Random walk, Simulation, Thermal model",

author = "Jun Guo and Sheqin Dong and Satoshi Goto",

year = "2009",

doi = "10.1109/ASICON.2009.5351279",

language = "English",

isbn = "9781424438686",

pages = "771--774",

booktitle = "ASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC",

note = "2009 8th IEEE International Conference on ASIC, ASICON 2009 ; Conference date: 20-10-2009 Through 23-10-2009",

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TY - GEN

T1 - Random walk algorithm for large thermal RC network analysis

AU - Guo, Jun

AU - Dong, Sheqin

AU - Goto, Satoshi

PY - 2009

Y1 - 2009

N2 - The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

AB - The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

KW - Integrated circuit

KW - Random walk

KW - Simulation

KW - Thermal model

UR - http://www.scopus.com/inward/record.url?scp=77949363466&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77949363466&partnerID=8YFLogxK

U2 - 10.1109/ASICON.2009.5351279

DO - 10.1109/ASICON.2009.5351279

M3 - Conference contribution

AN - SCOPUS:77949363466

SN - 9781424438686

SP - 771

EP - 774

BT - ASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC

T2 - 2009 8th IEEE International Conference on ASIC, ASICON 2009

Y2 - 20 October 2009 through 23 October 2009

ER -

Random walk algorithm for large thermal RC network analysis

Abstract

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Keywords

ASJC Scopus subject areas

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