Random walk algorithm for large thermal RC network analysis

Jun Guo, Sheqin Dong, Satoshi Goto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.

Original languageEnglish
Title of host publicationASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC
Pages771-774
Number of pages4
DOIs
Publication statusPublished - 2009
Event2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha
Duration: 2009 Oct 202009 Oct 23

Other

Other2009 8th IEEE International Conference on ASIC, ASICON 2009
CityChangsha
Period09/10/2009/10/23

Keywords

  • Integrated circuit
  • Random walk
  • Simulation
  • Thermal model

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Guo, J., Dong, S., & Goto, S. (2009). Random walk algorithm for large thermal RC network analysis. In ASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC (pp. 771-774). [5351279] https://doi.org/10.1109/ASICON.2009.5351279