REACTIVE GAS ION SOURCE.

H. Murakami, S. Ichimura, H. Shimizu, I. Kudo, S. Komaki, T. Tajima, Y. Tanaka, H. Naitho

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

Synchrotron Radiation (SR) is now attracting much attention as a promising source for X-ray lithography because of its high intensity and small divergence. In the usual way of fine pattern replication using SR, resist has been processed by wet chemical etching after exposure. Lithography by SR, however, generally requires vacuum conditions by the strong absorption of SR by air. Therefore, the resist process should be dry which in turn enables avoiding any pattern deterioration due to swelling during wet development. Recently, direct removal of resist materials by SR irradiation only has been observed. The objective of the present paper is to describe the design concept and the fundamental characteristics of a low energy reactive ion source, which has been designed for simultaneous use with SR to increase the direct engraving rate.

Original languageEnglish
Pages83-86
Number of pages4
Publication statusPublished - 1986 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Murakami, H., Ichimura, S., Shimizu, H., Kudo, I., Komaki, S., Tajima, T., Tanaka, Y., & Naitho, H. (1986). REACTIVE GAS ION SOURCE.. 83-86.