Recent progress in microjoining and nanojoining

Guisheng Zou, Jianfeng Yan, Fengwen Mu, Aiping Wu, Y. Norman Zhou

Research output: Contribution to journalReview article

18 Citations (Scopus)

Abstract

Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro- and nano-mechanical, electronic and medical devices and systems, and their recent progresses are briefly reviewed in this article. For electronic packaging applications, the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded. Typical joining methods including resistance micro-welding, laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed, as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads. Joining technologies were also introduced, including electron beam irradiating welding, strand wrapping bonding with Double-walled Carbon Nanotube Strands (DWNT) film and brazing, the welding technologies of metal nanoparticles realized through laser irradiation, and the novel process of low-temperature sintering bonding by using Ag, Cu, Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications. Based on the existing and new processes, the challenges and outlooks in micro- and nano-joining were pointed out.

Original languageEnglish
Pages (from-to)107-112
Number of pages6
JournalHanjie Xuebao/Transactions of the China Welding Institution
Volume32
Issue number4
Publication statusPublished - 2011 Apr 1
Externally publishedYes

Fingerprint

Joining
Electronics packaging
Brazing
Welding
Wire
Electron beam welding
Diffusion bonding
Metal nanoparticles
Laser beam welding
Laser beam effects
Carbon nanotubes
Sintering
Ultrasonics
Copper
Fabrication
Temperature

Keywords

  • Electronics
  • Medical device
  • Microjoining
  • Nanojoining
  • Nanoparticle

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Recent progress in microjoining and nanojoining. / Zou, Guisheng; Yan, Jianfeng; Mu, Fengwen; Wu, Aiping; Zhou, Y. Norman.

In: Hanjie Xuebao/Transactions of the China Welding Institution, Vol. 32, No. 4, 01.04.2011, p. 107-112.

Research output: Contribution to journalReview article

Zou, Guisheng ; Yan, Jianfeng ; Mu, Fengwen ; Wu, Aiping ; Zhou, Y. Norman. / Recent progress in microjoining and nanojoining. In: Hanjie Xuebao/Transactions of the China Welding Institution. 2011 ; Vol. 32, No. 4. pp. 107-112.
@article{d13c90ef4d75430fbd8c7628bdf8a69e,
title = "Recent progress in microjoining and nanojoining",
abstract = "Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro- and nano-mechanical, electronic and medical devices and systems, and their recent progresses are briefly reviewed in this article. For electronic packaging applications, the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded. Typical joining methods including resistance micro-welding, laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed, as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads. Joining technologies were also introduced, including electron beam irradiating welding, strand wrapping bonding with Double-walled Carbon Nanotube Strands (DWNT) film and brazing, the welding technologies of metal nanoparticles realized through laser irradiation, and the novel process of low-temperature sintering bonding by using Ag, Cu, Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications. Based on the existing and new processes, the challenges and outlooks in micro- and nano-joining were pointed out.",
keywords = "Electronics, Medical device, Microjoining, Nanojoining, Nanoparticle",
author = "Guisheng Zou and Jianfeng Yan and Fengwen Mu and Aiping Wu and Zhou, {Y. Norman}",
year = "2011",
month = "4",
day = "1",
language = "English",
volume = "32",
pages = "107--112",
journal = "Hanjie Xuebao/Transactions of the China Welding Institution",
issn = "0253-360X",
publisher = "Harbin Research Institute of Welding",
number = "4",

}

TY - JOUR

T1 - Recent progress in microjoining and nanojoining

AU - Zou, Guisheng

AU - Yan, Jianfeng

AU - Mu, Fengwen

AU - Wu, Aiping

AU - Zhou, Y. Norman

PY - 2011/4/1

Y1 - 2011/4/1

N2 - Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro- and nano-mechanical, electronic and medical devices and systems, and their recent progresses are briefly reviewed in this article. For electronic packaging applications, the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded. Typical joining methods including resistance micro-welding, laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed, as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads. Joining technologies were also introduced, including electron beam irradiating welding, strand wrapping bonding with Double-walled Carbon Nanotube Strands (DWNT) film and brazing, the welding technologies of metal nanoparticles realized through laser irradiation, and the novel process of low-temperature sintering bonding by using Ag, Cu, Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications. Based on the existing and new processes, the challenges and outlooks in micro- and nano-joining were pointed out.

AB - Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro- and nano-mechanical, electronic and medical devices and systems, and their recent progresses are briefly reviewed in this article. For electronic packaging applications, the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded. Typical joining methods including resistance micro-welding, laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed, as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads. Joining technologies were also introduced, including electron beam irradiating welding, strand wrapping bonding with Double-walled Carbon Nanotube Strands (DWNT) film and brazing, the welding technologies of metal nanoparticles realized through laser irradiation, and the novel process of low-temperature sintering bonding by using Ag, Cu, Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications. Based on the existing and new processes, the challenges and outlooks in micro- and nano-joining were pointed out.

KW - Electronics

KW - Medical device

KW - Microjoining

KW - Nanojoining

KW - Nanoparticle

UR - http://www.scopus.com/inward/record.url?scp=79957667746&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79957667746&partnerID=8YFLogxK

M3 - Review article

VL - 32

SP - 107

EP - 112

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

SN - 0253-360X

IS - 4

ER -