Recent progress in microjoining and nanojoining

Guisheng Zou, Jianfeng Yan, Fengwen Mu, Aiping Wu, Y. Norman Zhou

Research output: Contribution to journalReview article

20 Citations (Scopus)

Abstract

Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro- and nano-mechanical, electronic and medical devices and systems, and their recent progresses are briefly reviewed in this article. For electronic packaging applications, the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded. Typical joining methods including resistance micro-welding, laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed, as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads. Joining technologies were also introduced, including electron beam irradiating welding, strand wrapping bonding with Double-walled Carbon Nanotube Strands (DWNT) film and brazing, the welding technologies of metal nanoparticles realized through laser irradiation, and the novel process of low-temperature sintering bonding by using Ag, Cu, Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications. Based on the existing and new processes, the challenges and outlooks in micro- and nano-joining were pointed out.

Original languageEnglish
Pages (from-to)107-112
Number of pages6
JournalHanjie Xuebao/Transactions of the China Welding Institution
Volume32
Issue number4
Publication statusPublished - 2011 Apr 1
Externally publishedYes

Keywords

  • Electronics
  • Medical device
  • Microjoining
  • Nanojoining
  • Nanoparticle

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Zou, G., Yan, J., Mu, F., Wu, A., & Zhou, Y. N. (2011). Recent progress in microjoining and nanojoining. Hanjie Xuebao/Transactions of the China Welding Institution, 32(4), 107-112.