Redox Reactions at Cu,Ag/Ta2O5 Interfaces and the Effects of Ta2O5 Film Density on the Forming Process in Atomic Switch Structures

Tohru Tsuruoka*, Ilia Valov, Stefan Tappertzhofen, Jan Van Den Hurk, Tsuyoshi Hasegawa, Rainer Waser, Masakazu Aono

*Corresponding author for this work

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Engineering & Materials Science

Chemical Compounds

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