Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology

Hongbin Shi, Cuihua Tian, Satoshi Ikezawa, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Increasing functional density of portable electronic devices has led to the explosive growth in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the consequent smaller pads and solder joints, along with the introduction of brittle lead-free solder alloy, make the interconnect reliability of portable electronic devices more challenging. In this paper, triaxial strain gage array technology was used for monitoring the strain response of laptops under various field use conditions, including rotating a screen, knocking keys, holding a laptop, and so on. The failure analysis results for the ABP assemblies subjected to the above loadings indicated that there was obvious positive correlation between the extents of solder joint damage and strain level around the corresponding areas. In addition to assessing the interconnect reliability risk during different events, the triaxial strain gage array technology can also be applied to compare the impact of mechanical structure design modifications to the solder joint reliability and determine the optimal design.

    Original languageEnglish
    Title of host publicationProceedings of IEEE Sensors
    DOIs
    Publication statusPublished - 2012
    Event11th IEEE SENSORS 2012 Conference - Taipei
    Duration: 2012 Oct 282012 Oct 31

    Other

    Other11th IEEE SENSORS 2012 Conference
    CityTaipei
    Period12/10/2812/10/31

    Fingerprint

    Strain gages
    Soldering alloys
    Failure analysis
    Monitoring

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology. / Shi, Hongbin; Tian, Cuihua; Ikezawa, Satoshi; Ueda, Toshitsugu.

    Proceedings of IEEE Sensors. 2012. 6411345.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Shi, H, Tian, C, Ikezawa, S & Ueda, T 2012, Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology. in Proceedings of IEEE Sensors., 6411345, 11th IEEE SENSORS 2012 Conference, Taipei, 12/10/28. https://doi.org/10.1109/ICSENS.2012.6411345
    Shi, Hongbin ; Tian, Cuihua ; Ikezawa, Satoshi ; Ueda, Toshitsugu. / Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology. Proceedings of IEEE Sensors. 2012.
    @inproceedings{31da937d604c4322a8f30b709200ebfa,
    title = "Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology",
    abstract = "Increasing functional density of portable electronic devices has led to the explosive growth in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the consequent smaller pads and solder joints, along with the introduction of brittle lead-free solder alloy, make the interconnect reliability of portable electronic devices more challenging. In this paper, triaxial strain gage array technology was used for monitoring the strain response of laptops under various field use conditions, including rotating a screen, knocking keys, holding a laptop, and so on. The failure analysis results for the ABP assemblies subjected to the above loadings indicated that there was obvious positive correlation between the extents of solder joint damage and strain level around the corresponding areas. In addition to assessing the interconnect reliability risk during different events, the triaxial strain gage array technology can also be applied to compare the impact of mechanical structure design modifications to the solder joint reliability and determine the optimal design.",
    author = "Hongbin Shi and Cuihua Tian and Satoshi Ikezawa and Toshitsugu Ueda",
    year = "2012",
    doi = "10.1109/ICSENS.2012.6411345",
    language = "English",
    isbn = "9781457717659",
    booktitle = "Proceedings of IEEE Sensors",

    }

    TY - GEN

    T1 - Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology

    AU - Shi, Hongbin

    AU - Tian, Cuihua

    AU - Ikezawa, Satoshi

    AU - Ueda, Toshitsugu

    PY - 2012

    Y1 - 2012

    N2 - Increasing functional density of portable electronic devices has led to the explosive growth in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the consequent smaller pads and solder joints, along with the introduction of brittle lead-free solder alloy, make the interconnect reliability of portable electronic devices more challenging. In this paper, triaxial strain gage array technology was used for monitoring the strain response of laptops under various field use conditions, including rotating a screen, knocking keys, holding a laptop, and so on. The failure analysis results for the ABP assemblies subjected to the above loadings indicated that there was obvious positive correlation between the extents of solder joint damage and strain level around the corresponding areas. In addition to assessing the interconnect reliability risk during different events, the triaxial strain gage array technology can also be applied to compare the impact of mechanical structure design modifications to the solder joint reliability and determine the optimal design.

    AB - Increasing functional density of portable electronic devices has led to the explosive growth in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the consequent smaller pads and solder joints, along with the introduction of brittle lead-free solder alloy, make the interconnect reliability of portable electronic devices more challenging. In this paper, triaxial strain gage array technology was used for monitoring the strain response of laptops under various field use conditions, including rotating a screen, knocking keys, holding a laptop, and so on. The failure analysis results for the ABP assemblies subjected to the above loadings indicated that there was obvious positive correlation between the extents of solder joint damage and strain level around the corresponding areas. In addition to assessing the interconnect reliability risk during different events, the triaxial strain gage array technology can also be applied to compare the impact of mechanical structure design modifications to the solder joint reliability and determine the optimal design.

    UR - http://www.scopus.com/inward/record.url?scp=84873956659&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84873956659&partnerID=8YFLogxK

    U2 - 10.1109/ICSENS.2012.6411345

    DO - 10.1109/ICSENS.2012.6411345

    M3 - Conference contribution

    SN - 9781457717659

    BT - Proceedings of IEEE Sensors

    ER -