Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins

Keigo Mori, Naoshi Hirai, Yoshimichi Ohki, Yasutomo Otake, Takahiro Umemoto, Hirotaka Muto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Bisphenol A and F epoxy resins, EA and EF for short respectively, are used widely for insulation in power apparatus. In this paper, we compare the superiority in dielectric property between EA and EF. For EA and EF cured at two different conditions, the glass transition temperature (Tg), complex relative permittivity (ϵr' - jϵr), conductivity (σ), thermally stimulated depolarization current (TSDC), and bending elastic modulus were measured. As a result, EF has a lower Tg than EA. Regarding this, in EF, ϵr', ϵr, and σ rapidly increase when the temperature exceeds 140 °C and the difference in dielectric property between EA and EF becomes significant in this temperature range.

Original languageEnglish
Title of host publication2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages426-429
Number of pages4
ISBN (Electronic)9781728131214
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States
Duration: 2019 Oct 202019 Oct 23

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume2019-October
ISSN (Print)0084-9162

Conference

Conference2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
CountryUnited States
CityRichland
Period19/10/2019/10/23

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Mori, K., Hirai, N., Ohki, Y., Otake, Y., Umemoto, T., & Muto, H. (2019). Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings (pp. 426-429). [9010555] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP47102.2019.9010555