Relationship between bonding conditions and strength for joints using a Au nanoporous sheet

Kaori Matsunaga, Min Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

As the establishment of high-temperature lead-free solders and other interconnection technologies is an urgent priority in the electronics industry, a strong drive exists to find Pb-free alternatives for high-temperature bonding processes. We propose a no-solvent, no-flux solid-state bonding technique that uses a nanoporous sheet, a process we call nanoporous bonding (NPB). Nanoporous sheets can be made from binary alloys by selective dissolution of one element. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag binary alloy with nitric acid. The effects of joining conditions on the shear strength of joints using this sheet were investigated. The joints bonded at 350 °C showed high shear strengths of above 20 MPa. It was found that joining using Au NPB was successfully achieved, and that NPB shows potential as a Pb-free interconnection material for high-temperature electronic applications.

Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479940264
DOIs
Publication statusPublished - 2014 Nov 18
Event5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki
Duration: 2014 Sep 162014 Sep 18

Other

Other5th Electronics System-Integration Technology Conference, ESTC 2014
CityHelsinki
Period14/9/1614/9/18

Fingerprint

Binary alloys
Joining
Shear strength
Electronics industry
Nitric acid
Temperature
Dissolution
Fluxes
Lead-free solders

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M., & Mizuno, J. (2014). Relationship between bonding conditions and strength for joints using a Au nanoporous sheet. In Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 [6962855] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2014.6962855

Relationship between bonding conditions and strength for joints using a Au nanoporous sheet. / Matsunaga, Kaori; Kim, Min Su; Nishikawa, Hiroshi; Saito, Mikiko; Mizuno, Jun.

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 6962855.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsunaga, K, Kim, MS, Nishikawa, H, Saito, M & Mizuno, J 2014, Relationship between bonding conditions and strength for joints using a Au nanoporous sheet. in Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014., 6962855, Institute of Electrical and Electronics Engineers Inc., 5th Electronics System-Integration Technology Conference, ESTC 2014, Helsinki, 14/9/16. https://doi.org/10.1109/ESTC.2014.6962855
Matsunaga K, Kim MS, Nishikawa H, Saito M, Mizuno J. Relationship between bonding conditions and strength for joints using a Au nanoporous sheet. In Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 6962855 https://doi.org/10.1109/ESTC.2014.6962855
Matsunaga, Kaori ; Kim, Min Su ; Nishikawa, Hiroshi ; Saito, Mikiko ; Mizuno, Jun. / Relationship between bonding conditions and strength for joints using a Au nanoporous sheet. Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014.
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