Relationships of design parameters and the cooling performance of the spiral-fin heatsink

Shingo Otake, Motohito Hori, Ryoichi Kato, Yoshinari Ikeda, Victor Parque, Muhammad Khairi Faiz, Makoto Yoshida, Tomoyuki Miyashita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the demand for miniaturization, further improvement in cooling performance is required for power modules. The spiral-fin heatsink we considered has higher cooling performance than conventional ones. In this paper, we examined the design parameters of the spiral-fin, and found that three parameters of spiral-fin have big effect for the cooling performance .

Original languageEnglish
Title of host publication2021 International Conference on Electronics Packaging, ICEP 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages161-162
Number of pages2
ISBN (Electronic)9784991191114
DOIs
Publication statusPublished - 2021 May 12
Event20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
Duration: 2021 May 122021 May 14

Publication series

Name2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
Country/TerritoryJapan
CityTokyo
Period21/5/1221/5/14

Keywords

  • 3Dprinter
  • Heatsink

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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