Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation

H. Tanaka, S. Shimada, L. Anthony

Research output: Contribution to journalArticlepeer-review

79 Citations (Scopus)

Abstract

To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.

Original languageEnglish
Pages (from-to)53-56
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume56
Issue number1
DOIs
Publication statusPublished - 2007 Jan 1

Keywords

  • Ductile-mode machining
  • Silicon
  • Simulation

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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