Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation

H. Tanaka, S. Shimada, Laurence Anthony

    Research output: Contribution to journalArticle

    71 Citations (Scopus)

    Abstract

    To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.

    Original languageEnglish
    Pages (from-to)53-56
    Number of pages4
    JournalCIRP Annals - Manufacturing Technology
    Volume56
    Issue number1
    DOIs
    Publication statusPublished - 2007

    Fingerprint

    Molecular dynamics
    Machining
    Crystalline materials
    Silicon
    Computer simulation
    Shearing
    Stress analysis
    Compressive stress
    Phase transitions
    Defects

    Keywords

    • Ductile-mode machining
    • Silicon
    • Simulation

    ASJC Scopus subject areas

    • Mechanical Engineering
    • Industrial and Manufacturing Engineering

    Cite this

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    abstract = "To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.",
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    AU - Shimada, S.

    AU - Anthony, Laurence

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    AB - To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.

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