Abstract
To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.
| Original language | English |
|---|---|
| Pages (from-to) | 53-56 |
| Number of pages | 4 |
| Journal | CIRP Annals - Manufacturing Technology |
| Volume | 56 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2007 |
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Keywords
- Ductile-mode machining
- Silicon
- Simulation
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering
Cite this
Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation. / Tanaka, H.; Shimada, S.; Anthony, Laurence.
In: CIRP Annals - Manufacturing Technology, Vol. 56, No. 1, 2007, p. 53-56.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation
AU - Tanaka, H.
AU - Shimada, S.
AU - Anthony, Laurence
PY - 2007
Y1 - 2007
N2 - To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.
AB - To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.
KW - Ductile-mode machining
KW - Silicon
KW - Simulation
UR - http://www.scopus.com/inward/record.url?scp=73249147340&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=73249147340&partnerID=8YFLogxK
U2 - 10.1016/j.cirp.2007.05.015
DO - 10.1016/j.cirp.2007.05.015
M3 - Article
AN - SCOPUS:73249147340
VL - 56
SP - 53
EP - 56
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
IS - 1
ER -