Abstract
To obtain scientific guidelines for ductile-mode machining, nano-mdentation, nano-bending, and nanomachining of defect-free mono-crystalline silicon are investigated by molecular dynamics simulation. Results show that amorphous phase transformation of silicon is a key mechanism for inelastic deformation, and stable shearing of the amorphous is necessary for ductile-mode machining. Stress analysis suggests that stable shearing takes place under a compressive stress field. In practice, a sharp cutting edge tool with a large negative rake angle should be used for effective ductile-mode machining, and vibration machining should be applied for larger depths of cut as it enlarges the amorphous region in front of the cutting edge.
Original language | English |
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Pages (from-to) | 53-56 |
Number of pages | 4 |
Journal | CIRP Annals - Manufacturing Technology |
Volume | 56 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2007 Jan 1 |
Keywords
- Ductile-mode machining
- Silicon
- Simulation
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering