Robust 3D reconstruction with omni-directional camera based on structure from motion

Mengcheng Song, Hiroshi Watanabe, Junich Hara

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    3D scenes reconstruction with omni-directional camera is of utmost significance as the camera can capture the 360 degrees scene. It dramatically improves the performance of Structure from Motion (SfM) since the tracked interest points will not miss with a long base-line and sharp rotation. This paper proposes a system with preprocessing and modification based on conventional SfM pipeline for equirectangular images produced by omni-directional camera. The results show that proposed system can well estimate the accurate ego-motion and sparse 3D structure of a synthetic scene as well as a real-world scene by solving the problem of distortion and lower quality at certain area of the equirectangular images.

    Original languageEnglish
    Title of host publication2018 International Workshop on Advanced Image Technology, IWAIT 2018
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1-4
    Number of pages4
    ISBN (Electronic)9781538626153
    DOIs
    Publication statusPublished - 2018 May 30
    Event2018 International Workshop on Advanced Image Technology, IWAIT 2018 - Chiang Mai, Thailand
    Duration: 2018 Jan 72018 Jan 9

    Other

    Other2018 International Workshop on Advanced Image Technology, IWAIT 2018
    CountryThailand
    CityChiang Mai
    Period18/1/718/1/9

    Keywords

    • 3D structure
    • ego-motion
    • Omni-directional camera
    • structure from motion

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Computer Vision and Pattern Recognition
    • Media Technology

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  • Cite this

    Song, M., Watanabe, H., & Hara, J. (2018). Robust 3D reconstruction with omni-directional camera based on structure from motion. In 2018 International Workshop on Advanced Image Technology, IWAIT 2018 (pp. 1-4). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWAIT.2018.8369715