Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites

Xingyi Huang, Tomonori Iizuka, Pingkai Jiang, Yoshimichi Ohki, Toshikatsu Tanaka

Research output: Contribution to journalArticle

240 Citations (Scopus)

Abstract

The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the interface on the thermal conductivity of the composite with low filler loading are well documented, whereas the role of the interface in highly filled polymer composites is not clear. Here we report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites. Six kinds of surface treated and as received AlN particles are used as fillers. Three kinds of treated AlN are functionalized by silanes, i.e., amino, epoxy, and mercapto group terminated silanes. Others are functionalized by three kinds of materials, i.e., polyhedral oligomeric silsesquioxane (POSS), hyperbranched polymer, and graphene oxide (GO). An intensive study was made to clarify how the variation of the modifier would affect the microstructure, density, interfacial adhesion, and thus the final thermal conductivity of the composites. It was found that the thermal conductivity enhancement of the composites is not only dependent on the type and physicochemical nature of the modifiers but also dependent on the filler loading. In addition, some unexpected results were found in the composites with particle loading higher than the percolation threshold. For instance, the composites with AlN treated by the silane uncapable of reacting with the epoxy resin show the most effective enhancement of the thermal conductivity. Finally, dielectric spectroscopy was used to evaluate the insulating properties of the composites. This work sets the way toward the choice of a proper modifier for enhancing the thermal conductivity of highly filled dielectric polymer composites.

Original languageEnglish
Pages (from-to)13629-13639
Number of pages11
JournalJournal of Physical Chemistry C
Volume116
Issue number25
DOIs
Publication statusPublished - 2012 Jun 28

Fingerprint

Thermal conductivity
thermal conductivity
composite materials
Composite materials
fillers
Silanes
Fillers
silanes
Polymers
polymers
Epoxy Resins
Filled polymers
Dielectric spectroscopy
Graphite
augmentation
dendrimers
epoxy resins
Epoxy resins
Oxides
Graphene

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Energy(all)

Cite this

Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites. / Huang, Xingyi; Iizuka, Tomonori; Jiang, Pingkai; Ohki, Yoshimichi; Tanaka, Toshikatsu.

In: Journal of Physical Chemistry C, Vol. 116, No. 25, 28.06.2012, p. 13629-13639.

Research output: Contribution to journalArticle

@article{7d61ef376b244fce801341c9d829dfe1,
title = "Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites",
abstract = "The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the interface on the thermal conductivity of the composite with low filler loading are well documented, whereas the role of the interface in highly filled polymer composites is not clear. Here we report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites. Six kinds of surface treated and as received AlN particles are used as fillers. Three kinds of treated AlN are functionalized by silanes, i.e., amino, epoxy, and mercapto group terminated silanes. Others are functionalized by three kinds of materials, i.e., polyhedral oligomeric silsesquioxane (POSS), hyperbranched polymer, and graphene oxide (GO). An intensive study was made to clarify how the variation of the modifier would affect the microstructure, density, interfacial adhesion, and thus the final thermal conductivity of the composites. It was found that the thermal conductivity enhancement of the composites is not only dependent on the type and physicochemical nature of the modifiers but also dependent on the filler loading. In addition, some unexpected results were found in the composites with particle loading higher than the percolation threshold. For instance, the composites with AlN treated by the silane uncapable of reacting with the epoxy resin show the most effective enhancement of the thermal conductivity. Finally, dielectric spectroscopy was used to evaluate the insulating properties of the composites. This work sets the way toward the choice of a proper modifier for enhancing the thermal conductivity of highly filled dielectric polymer composites.",
author = "Xingyi Huang and Tomonori Iizuka and Pingkai Jiang and Yoshimichi Ohki and Toshikatsu Tanaka",
year = "2012",
month = "6",
day = "28",
doi = "10.1021/jp3026545",
language = "English",
volume = "116",
pages = "13629--13639",
journal = "Journal of Physical Chemistry C",
issn = "1932-7447",
publisher = "American Chemical Society",
number = "25",

}

TY - JOUR

T1 - Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites

AU - Huang, Xingyi

AU - Iizuka, Tomonori

AU - Jiang, Pingkai

AU - Ohki, Yoshimichi

AU - Tanaka, Toshikatsu

PY - 2012/6/28

Y1 - 2012/6/28

N2 - The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the interface on the thermal conductivity of the composite with low filler loading are well documented, whereas the role of the interface in highly filled polymer composites is not clear. Here we report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites. Six kinds of surface treated and as received AlN particles are used as fillers. Three kinds of treated AlN are functionalized by silanes, i.e., amino, epoxy, and mercapto group terminated silanes. Others are functionalized by three kinds of materials, i.e., polyhedral oligomeric silsesquioxane (POSS), hyperbranched polymer, and graphene oxide (GO). An intensive study was made to clarify how the variation of the modifier would affect the microstructure, density, interfacial adhesion, and thus the final thermal conductivity of the composites. It was found that the thermal conductivity enhancement of the composites is not only dependent on the type and physicochemical nature of the modifiers but also dependent on the filler loading. In addition, some unexpected results were found in the composites with particle loading higher than the percolation threshold. For instance, the composites with AlN treated by the silane uncapable of reacting with the epoxy resin show the most effective enhancement of the thermal conductivity. Finally, dielectric spectroscopy was used to evaluate the insulating properties of the composites. This work sets the way toward the choice of a proper modifier for enhancing the thermal conductivity of highly filled dielectric polymer composites.

AB - The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the interface on the thermal conductivity of the composite with low filler loading are well documented, whereas the role of the interface in highly filled polymer composites is not clear. Here we report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites. Six kinds of surface treated and as received AlN particles are used as fillers. Three kinds of treated AlN are functionalized by silanes, i.e., amino, epoxy, and mercapto group terminated silanes. Others are functionalized by three kinds of materials, i.e., polyhedral oligomeric silsesquioxane (POSS), hyperbranched polymer, and graphene oxide (GO). An intensive study was made to clarify how the variation of the modifier would affect the microstructure, density, interfacial adhesion, and thus the final thermal conductivity of the composites. It was found that the thermal conductivity enhancement of the composites is not only dependent on the type and physicochemical nature of the modifiers but also dependent on the filler loading. In addition, some unexpected results were found in the composites with particle loading higher than the percolation threshold. For instance, the composites with AlN treated by the silane uncapable of reacting with the epoxy resin show the most effective enhancement of the thermal conductivity. Finally, dielectric spectroscopy was used to evaluate the insulating properties of the composites. This work sets the way toward the choice of a proper modifier for enhancing the thermal conductivity of highly filled dielectric polymer composites.

UR - http://www.scopus.com/inward/record.url?scp=84863110620&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84863110620&partnerID=8YFLogxK

U2 - 10.1021/jp3026545

DO - 10.1021/jp3026545

M3 - Article

AN - SCOPUS:84863110620

VL - 116

SP - 13629

EP - 13639

JO - Journal of Physical Chemistry C

JF - Journal of Physical Chemistry C

SN - 1932-7447

IS - 25

ER -