Room-temperature bonding technique based on copper nanowire surface fastener

Peng Wang, Yang Ju, Mingji Chen, Atsushi Hosoi, Yuanhui Song, Yuka Iwasaki

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A roomtemperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other.

Original languageEnglish
Article number035001
JournalApplied Physics Express
Volume6
Issue number3
DOIs
Publication statusPublished - 2013 Mar
Externally publishedYes

Fingerprint

fasteners
Fasteners
Nanowires
nanowires
Copper
copper
room temperature
Temperature
Van der Waals forces
pressing
Electrodeposition
electrodeposition
Strength of materials
Electric properties
templates
electrical properties
mechanical properties
Silicon
Mechanical properties
silicon

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Room-temperature bonding technique based on copper nanowire surface fastener. / Wang, Peng; Ju, Yang; Chen, Mingji; Hosoi, Atsushi; Song, Yuanhui; Iwasaki, Yuka.

In: Applied Physics Express, Vol. 6, No. 3, 035001, 03.2013.

Research output: Contribution to journalArticle

Wang, Peng ; Ju, Yang ; Chen, Mingji ; Hosoi, Atsushi ; Song, Yuanhui ; Iwasaki, Yuka. / Room-temperature bonding technique based on copper nanowire surface fastener. In: Applied Physics Express. 2013 ; Vol. 6, No. 3.
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