Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

Peng Wang, Yang Ju, Atsushi Hosoi, Yuanhui Song

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm2 and electrical resistance of 0.3 (areas, A3.14 mm2) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.

Original languageEnglish
Title of host publicationProceedings of the IEEE Conference on Nanotechnology
Publication statusPublished - 2012
Externally publishedYes
Event2012 12th IEEE International Conference on Nanotechnology, NANO 2012 - Birmingham
Duration: 2012 Aug 202012 Aug 23


Other2012 12th IEEE International Conference on Nanotechnology, NANO 2012


ASJC Scopus subject areas

  • Bioengineering
  • Electrical and Electronic Engineering
  • Materials Chemistry
  • Condensed Matter Physics

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