Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties

Peng Wang, Yang Ju, Atsushi Hosoi, Yuanhui Song

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presented a room temperature bonding technique based on copper nanowire. A structure with copper nanowire array growing on the patterned areas of the silicon substrate was prepared through template-assistant electro-deposition. Through pressing the tilted and straight nanowire arrays against each other, the van der Waals interactions between the interconnected nanowires resulted in the mechanical bonding and electrical connectivity. This room temperature bonding technique exhibited anisotropic adhesion properties. The maximum adhesive strength of 9.36 N/cm2 and electrical resistance of 0.3 (areas, A3.14 mm2) were obtained. Hence, it might have important implications for the assembly of components in the micro electronics.

Original languageEnglish
Title of host publicationProceedings of the IEEE Conference on Nanotechnology
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 12th IEEE International Conference on Nanotechnology, NANO 2012 - Birmingham
Duration: 2012 Aug 202012 Aug 23

Other

Other2012 12th IEEE International Conference on Nanotechnology, NANO 2012
CityBirmingham
Period12/8/2012/8/23

Fingerprint

fasteners
Fasteners
Nanowires
Copper
adhesion
nanowires
Adhesion
copper
room temperature
Temperature
Acoustic impedance
Silicon
pressing
electrical resistance
Electrodeposition
microelectronics
Microelectronics
electrodeposition
adhesives
Adhesives

ASJC Scopus subject areas

  • Bioengineering
  • Electrical and Electronic Engineering
  • Materials Chemistry
  • Condensed Matter Physics

Cite this

Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties. / Wang, Peng; Ju, Yang; Hosoi, Atsushi; Song, Yuanhui.

Proceedings of the IEEE Conference on Nanotechnology. 2012. 6322167.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, P, Ju, Y, Hosoi, A & Song, Y 2012, Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties. in Proceedings of the IEEE Conference on Nanotechnology., 6322167, 2012 12th IEEE International Conference on Nanotechnology, NANO 2012, Birmingham, 12/8/20. https://doi.org/10.1109/NANO.2012.6322167
Wang, Peng ; Ju, Yang ; Hosoi, Atsushi ; Song, Yuanhui. / Room temperature electrical bonding technique based on titled copper nanowire fastener with anisotropic adhesion properties. Proceedings of the IEEE Conference on Nanotechnology. 2012.
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