Abstract
Large size of capacitors is the main hurdle in miniaturization of current electronic devices. Herein, a scalable solution-based layer-by-layer engineering of metallic and high-κ dielectric nanosheets into multilayer nanosheet capacitors (MNCs) with overall thickness of ≈20 nm is presented. The MNCs are built through neat tiling of 2D metallic Ru0.95O20.2− and high-κ dielectric Ca2NaNb4O13− nanosheets via the Langmuir–Blodgett (LB) approach at room temperature which is verified by cross-sectional high-resolution transmission electron microscopy (HRTEM). The resultant MNCs demonstrate a high capacitance of 40–52 µF cm−2 and low leakage currents down to 10−5–10−6 A cm−2. Such MNCs also possess complimentary in situ robust dielectric properties under high-temperature measurements up to 250 °C. Based on capacitance normalized by the thickness, the developed MNC outperforms state-of-the-art multilayer ceramic capacitors (MLCC, ≈22 µF cm−2/5 × 104 nm) present in the market. The strategy is effective due to the advantages of facile, economical, and ambient temperature solution assembly.
Original language | English |
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Article number | 2003485 |
Journal | Small |
Volume | 16 |
Issue number | 39 |
DOIs | |
Publication status | Published - 2020 Oct 1 |
Externally published | Yes |
Keywords
- 2D oxide nanosheets
- capacitors
- high-κ dielectrics
- layer-by-layer assembly
ASJC Scopus subject areas
- Biotechnology
- Biomaterials
- Chemistry(all)
- Materials Science(all)