Self-alignment method on a temperature-controlled transfer

Eiji Iwase, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Contribution to journalArticle

Abstract

We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

Original languageEnglish
JournalIEEJ Transactions on Sensors and Micromachines
Volume130
Issue number5
DOIs
Publication statusPublished - 2010
Externally publishedYes

Fingerprint

Soldering alloys
Melting point
Substrates
Temperature
Surface tension
Adhesives

Keywords

  • Low-melting point solder
  • Poly(ethylene glycol)
  • Self-alignment
  • Temperature-controlled transfer

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Self-alignment method on a temperature-controlled transfer. / Iwase, Eiji; Onoe, Hiroaki; Nakai, Akihito; Matsumoto, Kiyoshi; Shimoyama, Isao.

In: IEEJ Transactions on Sensors and Micromachines, Vol. 130, No. 5, 2010.

Research output: Contribution to journalArticle

Iwase, Eiji ; Onoe, Hiroaki ; Nakai, Akihito ; Matsumoto, Kiyoshi ; Shimoyama, Isao. / Self-alignment method on a temperature-controlled transfer. In: IEEJ Transactions on Sensors and Micromachines. 2010 ; Vol. 130, No. 5.
@article{9ec2ab301f714ce286280d10dd3af1d1,
title = "Self-alignment method on a temperature-controlled transfer",
abstract = "We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 {\%} of the contact pad size.",
keywords = "Low-melting point solder, Poly(ethylene glycol), Self-alignment, Temperature-controlled transfer",
author = "Eiji Iwase and Hiroaki Onoe and Akihito Nakai and Kiyoshi Matsumoto and Isao Shimoyama",
year = "2010",
doi = "10.1541/ieejsmas.130.188",
language = "English",
volume = "130",
journal = "IEEJ Transactions on Sensors and Micromachines",
issn = "1341-8939",
publisher = "The Institute of Electrical Engineers of Japan",
number = "5",

}

TY - JOUR

T1 - Self-alignment method on a temperature-controlled transfer

AU - Iwase, Eiji

AU - Onoe, Hiroaki

AU - Nakai, Akihito

AU - Matsumoto, Kiyoshi

AU - Shimoyama, Isao

PY - 2010

Y1 - 2010

N2 - We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

AB - We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

KW - Low-melting point solder

KW - Poly(ethylene glycol)

KW - Self-alignment

KW - Temperature-controlled transfer

UR - http://www.scopus.com/inward/record.url?scp=77953596748&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77953596748&partnerID=8YFLogxK

U2 - 10.1541/ieejsmas.130.188

DO - 10.1541/ieejsmas.130.188

M3 - Article

AN - SCOPUS:77953596748

VL - 130

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

SN - 1341-8939

IS - 5

ER -