Self-Healing Metal Interconnect for Flexible Electronic Device

Tomoya Koshi; Eiji Iwase

doi:10.23919/ICEP.2019.8733474

Self-Healing Metal Interconnect for Flexible Electronic Device

Tomoya Koshi, Eiji Iwase

School of Fundamental Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

Original language	English
Title of host publication	2019 International Conference on Electronics Packaging, ICEP 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	291-293
Number of pages	3
ISBN (Electronic)	9784990218867
DOIs	https://doi.org/10.23919/ICEP.2019.8733474
Publication status	Published - 2019 Apr
Event	2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan Duration: 2019 Apr 17 → 2019 Apr 20

Publication series

Name	2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference	2019 International Conference on Electronics Packaging, ICEP 2019
Country/Territory	Japan
City	Niigata
Period	19/4/17 → 19/4/20

Keywords

dielectrophoresis
flexible electronic device
metal nanoparticle
self-healing

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Metals and Alloys

Access to Document

10.23919/ICEP.2019.8733474

Cite this

Self-Healing Metal Interconnect for Flexible Electronic Device. / Koshi, Tomoya; Iwase, Eiji.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 291-293 8733474 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Koshi, T & Iwase, E 2019, Self-Healing Metal Interconnect for Flexible Electronic Device. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733474, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 291-293, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2019.8733474

@inproceedings{b8f372a514ea498b84076864eb44b346,

title = "Self-Healing Metal Interconnect for Flexible Electronic Device",

abstract = "We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.",

keywords = "dielectrophoresis, flexible electronic device, metal nanoparticle, self-healing",

author = "Tomoya Koshi and Eiji Iwase",

year = "2019",

month = apr,

doi = "10.23919/ICEP.2019.8733474",

language = "English",

series = "2019 International Conference on Electronics Packaging, ICEP 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "291--293",

booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",

note = "2019 International Conference on Electronics Packaging, ICEP 2019 ; Conference date: 17-04-2019 Through 20-04-2019",

}

TY - GEN

T1 - Self-Healing Metal Interconnect for Flexible Electronic Device

AU - Koshi, Tomoya

AU - Iwase, Eiji

PY - 2019/4

Y1 - 2019/4

N2 - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

AB - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

KW - dielectrophoresis

KW - flexible electronic device

KW - metal nanoparticle

KW - self-healing

UR - http://www.scopus.com/inward/record.url?scp=85068308798&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068308798&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2019.8733474

DO - 10.23919/ICEP.2019.8733474

M3 - Conference contribution

AN - SCOPUS:85068308798

T3 - 2019 International Conference on Electronics Packaging, ICEP 2019

SP - 291

EP - 293

BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 International Conference on Electronics Packaging, ICEP 2019

Y2 - 17 April 2019 through 20 April 2019

ER -

Self-Healing Metal Interconnect for Flexible Electronic Device

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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