Self-Healing Metal Interconnect for Flexible Electronic Device

Tomoya Koshi, Eiji Iwase

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages291-293
Number of pages3
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19/4/1719/4/20

Fingerprint

Flexible electronics
Metals
Light emitting diodes
Regain
Metal nanoparticles
Electrophoresis
Stretching
Fabrication

Keywords

  • dielectrophoresis
  • flexible electronic device
  • metal nanoparticle
  • self-healing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Koshi, T., & Iwase, E. (2019). Self-Healing Metal Interconnect for Flexible Electronic Device. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 291-293). [8733474] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733474

Self-Healing Metal Interconnect for Flexible Electronic Device. / Koshi, Tomoya; Iwase, Eiji.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 291-293 8733474 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Koshi, T & Iwase, E 2019, Self-Healing Metal Interconnect for Flexible Electronic Device. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733474, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 291-293, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2019.8733474
Koshi T, Iwase E. Self-Healing Metal Interconnect for Flexible Electronic Device. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 291-293. 8733474. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733474
Koshi, Tomoya ; Iwase, Eiji. / Self-Healing Metal Interconnect for Flexible Electronic Device. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 291-293 (2019 International Conference on Electronics Packaging, ICEP 2019).
@inproceedings{b8f372a514ea498b84076864eb44b346,
title = "Self-Healing Metal Interconnect for Flexible Electronic Device",
abstract = "We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.",
keywords = "dielectrophoresis, flexible electronic device, metal nanoparticle, self-healing",
author = "Tomoya Koshi and Eiji Iwase",
year = "2019",
month = "4",
day = "1",
doi = "10.23919/ICEP.2019.8733474",
language = "English",
series = "2019 International Conference on Electronics Packaging, ICEP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "291--293",
booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",

}

TY - GEN

T1 - Self-Healing Metal Interconnect for Flexible Electronic Device

AU - Koshi, Tomoya

AU - Iwase, Eiji

PY - 2019/4/1

Y1 - 2019/4/1

N2 - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

AB - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.

KW - dielectrophoresis

KW - flexible electronic device

KW - metal nanoparticle

KW - self-healing

UR - http://www.scopus.com/inward/record.url?scp=85068308798&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068308798&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2019.8733474

DO - 10.23919/ICEP.2019.8733474

M3 - Conference contribution

T3 - 2019 International Conference on Electronics Packaging, ICEP 2019

SP - 291

EP - 293

BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

ER -