Sequential Batch Assembly of 3-D Microstructures by using a Magnetic Anisotropy and a Magnetic Field

Eiji Iwase, Isao Shimoyama

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.

Original languageEnglish
Pages (from-to)224-230
Number of pages7
JournalIEEJ Transactions on Sensors and Micromachines
Volume123
Issue number7
DOIs
Publication statusPublished - 2003
Externally publishedYes

Fingerprint

Magnetic anisotropy
Magnetic fields
Microstructure
Hinges
Magnetic materials
Torque
Nickel
Stiffness
Substrates

Keywords

  • elastic hinges
  • magnetic anisotropy
  • MEMS(Micro-Electro-Mechanical Systems)
  • out-of-plane structures
  • sequential assembly

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Sequential Batch Assembly of 3-D Microstructures by using a Magnetic Anisotropy and a Magnetic Field. / Iwase, Eiji; Shimoyama, Isao.

In: IEEJ Transactions on Sensors and Micromachines, Vol. 123, No. 7, 2003, p. 224-230.

Research output: Contribution to journalArticle

@article{3303b185f7b145dea194237d3064cf7d,
title = "Sequential Batch Assembly of 3-D Microstructures by using a Magnetic Anisotropy and a Magnetic Field",
abstract = "This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.",
keywords = "elastic hinges, magnetic anisotropy, MEMS(Micro-Electro-Mechanical Systems), out-of-plane structures, sequential assembly",
author = "Eiji Iwase and Isao Shimoyama",
year = "2003",
doi = "10.1541/ieejsmas.123.224",
language = "English",
volume = "123",
pages = "224--230",
journal = "IEEJ Transactions on Sensors and Micromachines",
issn = "1341-8939",
publisher = "The Institute of Electrical Engineers of Japan",
number = "7",

}

TY - JOUR

T1 - Sequential Batch Assembly of 3-D Microstructures by using a Magnetic Anisotropy and a Magnetic Field

AU - Iwase, Eiji

AU - Shimoyama, Isao

PY - 2003

Y1 - 2003

N2 - This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.

AB - This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts a hinged structure by the torque due to the shape magnetic anisotropy. We made micro flap structures (4.5 μm-thick electroplated Permalloy) which have 0.2 μ,m-thick nickel elastic hinges in various size, and made lift the structures in a magnetic field up to 50 kA/m. We demonstrated that the non-dimensional factor depending on the volume of magnetic material and the stiffness of the hinges determine the sensitivity to the magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. The each two plates 600 μm x 600 μm in size were lifted sequentially, and out-of-plane microstructures were assembled. And the complex out-of-plan microstructures, the regular tetrahedrons 800 μm on a side with a closed linkage were able to assemble by our method.

KW - elastic hinges

KW - magnetic anisotropy

KW - MEMS(Micro-Electro-Mechanical Systems)

KW - out-of-plane structures

KW - sequential assembly

UR - http://www.scopus.com/inward/record.url?scp=26844474901&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=26844474901&partnerID=8YFLogxK

U2 - 10.1541/ieejsmas.123.224

DO - 10.1541/ieejsmas.123.224

M3 - Article

VL - 123

SP - 224

EP - 230

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

SN - 1341-8939

IS - 7

ER -