Sequential batch assembly of 3-D microstructures with elastic hinges by a magnetic field

Eiji Iwase, Shoji Takeuchi, Isao Shimoyama

Research output: Contribution to conferencePaper

9 Citations (Scopus)

Abstract

This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts up a hinged structure due to the shape magnetic anisotropy. Micro flap structures (4.5 μm-thick electroplated Permalloy) having 0.2 μm-thick nickel elastic hinges with various lengths and widths are bent in out-of-plane direction in a magnetic field up to 50 kA/m. The volume of magnetic material and the stiffness of the hinges determine the sensitivity to a magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. By way of the example, we have erected plates 600 μm × 600 μm in size. Also, structures bent at 90 and 45 degrees out of the plane have been obtained at the same time.

Original languageEnglish
Pages188-191
Number of pages4
Publication statusPublished - 2002 Jan 1
Event15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States
Duration: 2002 Jan 202002 Jan 24

Conference

Conference15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
CountryUnited States
CityLas Vegas, NV
Period02/1/2002/1/24

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Iwase, E., Takeuchi, S., & Shimoyama, I. (2002). Sequential batch assembly of 3-D microstructures with elastic hinges by a magnetic field. 188-191. Paper presented at 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, Las Vegas, NV, United States.