Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding

Shinichi Terashima, Yukihiro Yamamoto, Tomohiro Uno, Kohei Tatsumi

Research output: Contribution to journalConference article


Significant reduction of the wire sweep in molding is proposed because the wire sweep is considered to be the major problem to realise wire bonding with ultra fine pitches of under 30 micrometers. In the present proposal, Ni was plated for several micrometers before molding on bonded Au wires. Ni plating was carried out by means of electroless plating for several minutes in the aqueous solution kept at 358K containing Ni and P. The wire sweep ratio for Ni plated wire (total diameter was 21 micrometers) was almost half of that for Au wire with the diameter of 15 micrometers except Ni plate, and was slightly smaller than that for Au wire with the diameter of 25 micrometers except Ni plate even the total diameter was smaller. It is considered that wire sweep suppression by this technique was due to the enhancement of both elastic and plastic properties.

Original languageEnglish
Pages (from-to)891-896
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 2002 Jan 1
Event52nd Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 2002 May 282002 May 31


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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