Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding

Shinichi Terashima, Yukihiro Yamamoto, Tomohiro Uno, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Significant reduction of the wire sweep in molding is proposed because the wire sweep is considered to be the major problem to realise wire bonding with ultra fine pitches of under 30 micrometers. In the present proposal, Ni was plated for several micrometers before molding on bonded Au wires. Ni plating was carried out by means of electroless plating for several minutes in the aqueous solution kept at 358K containing Ni and P. The wire sweep ratio for Ni plated wire (total diameter was 21 micrometers) was almost half of that for Au wire with the diameter of 15 micrometers except Ni plate, and was slightly smaller than that for Au wire with the diameter of 25 micrometers except Ni plate even the total diameter was smaller. It is considered that wire sweep suppression by this technique was due to the enhancement of both elastic and plastic properties.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages891-896
Number of pages6
Publication statusPublished - 2002
Externally publishedYes
Event52nd Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 2002 May 282002 May 31

Other

Other52nd Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period02/5/2802/5/31

Fingerprint

Plating
Wire
Molding
Electroless plating
Plastics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Terashima, S., Yamamoto, Y., Uno, T., & Tatsumi, K. (2002). Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding. In Proceedings - Electronic Components and Technology Conference (pp. 891-896)

Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding. / Terashima, Shinichi; Yamamoto, Yukihiro; Uno, Tomohiro; Tatsumi, Kohei.

Proceedings - Electronic Components and Technology Conference. 2002. p. 891-896.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Terashima, S, Yamamoto, Y, Uno, T & Tatsumi, K 2002, Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding. in Proceedings - Electronic Components and Technology Conference. pp. 891-896, 52nd Electronic Components and Technology Conference, San Diego, CA, United States, 02/5/28.
Terashima S, Yamamoto Y, Uno T, Tatsumi K. Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding. In Proceedings - Electronic Components and Technology Conference. 2002. p. 891-896
Terashima, Shinichi ; Yamamoto, Yukihiro ; Uno, Tomohiro ; Tatsumi, Kohei. / Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding. Proceedings - Electronic Components and Technology Conference. 2002. pp. 891-896
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