Simple through silicon interconnect via fabrication using dry filling of sub-micron Au particles for 3D MEMS

K. Shih*, M. Nimura, Y. Kanehira, T. Ogashiwa, J. Mizuno, S. Shoji

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Simple through silicon interconnect via fabrication using dry filling of sub-micron Au particles for 3D MEMS'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy