TY - GEN
T1 - Simulation of grain growth of materials produced by severe plastic deformation
AU - Mizuno, Yuichi
AU - Okushiro, Kenji
AU - Saito, Yoshiyuki
PY - 2012
Y1 - 2012
N2 - Grain boundary migration in materials under severe plastic deformation was simulated by the phase field methods. The interface energy and dislocation density on growth kinetics were simulated on systems of 2-dimensional lattice. .In inhomogeneous systems grain size distributions in simulated grain structures were binodal distributions. The classification of the solution of differential equations based on the mean-field Hillert model describing temporal evolution of the scaled grain size distribution function was in good agreement with those given by the Computer simulations. Effect of dislocation on thermodynamic stability was taken into consideration. Dislocation density distribution was calculated by a equation based on the diffusion-reaction equation. Scaled grain size distribution was known to be affected by the dislocation.
AB - Grain boundary migration in materials under severe plastic deformation was simulated by the phase field methods. The interface energy and dislocation density on growth kinetics were simulated on systems of 2-dimensional lattice. .In inhomogeneous systems grain size distributions in simulated grain structures were binodal distributions. The classification of the solution of differential equations based on the mean-field Hillert model describing temporal evolution of the scaled grain size distribution function was in good agreement with those given by the Computer simulations. Effect of dislocation on thermodynamic stability was taken into consideration. Dislocation density distribution was calculated by a equation based on the diffusion-reaction equation. Scaled grain size distribution was known to be affected by the dislocation.
KW - Dislocation dynamics
KW - Grain growth
KW - Phase field model
KW - Secondary recrystallization
KW - Severe plastic deformation
UR - http://www.scopus.com/inward/record.url?scp=84855213578&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84855213578&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.409.597
DO - 10.4028/www.scientific.net/AMR.409.597
M3 - Conference contribution
AN - SCOPUS:84855213578
SN - 9783037853047
VL - 409
T3 - Advanced Materials Research
SP - 597
EP - 602
BT - Advanced Materials Research
T2 - 7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011
Y2 - 1 August 2011 through 5 August 2011
ER -