Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose a technique for the simultaneous fabrication of a through-glass interconnect via (TGV) and Au bumps using dry filling process of submicron Au particles. First, dry film resist holes were fabricated over glass through holes by photolithography. Next, submicron Au particles were filled into both the glass and resist holes, and sintered. We define a TGV sandwiched between two Au bumps as I-structure TGV. Cross-sectional SEM images showed that the proposed I-structure TGV was successfully fabricated without significant voids. Furthermore, the glass substrate covered with thin Au film and the Au bumps were well sealed because the Au particles shrank during a sintering. Four-probe method using daisy chain revealed that the resistance of the single I-structure TGV was 0.11 Ω. These results indicate that the proposed fabrication method will be very useful for various applications of glass interposers or glass IC chips.

Original languageEnglish
Title of host publication11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
PublisherIEEE Computer Society
Pages270-272
Number of pages3
ISBN (Electronic)9781509047697
DOIs
Publication statusPublished - 2016 Dec 27
Event11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan, Province of China
Duration: 2016 Oct 262016 Oct 28

Other

Other11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
CountryTaiwan, Province of China
CityTaipei
Period16/10/2616/10/28

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Nomura, K., Okada, A., Shoji, S., Ogashiwa, T., & Mizuno, J. (2016). Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles. In 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings (pp. 270-272). [7799988] IEEE Computer Society. https://doi.org/10.1109/IMPACT.2016.7799988