TY - JOUR
T1 - Sinter-free stretchable conductive inks composed of polystyrene-block-polybutadiene-block-polystyrene and silver flakes in tetrahydrofuran
AU - Nakanishi, Takenori
AU - Yamagishi, Kento
AU - Iwase, Eiji
AU - Iwata, Hiroyasu
AU - Takeoka, Shinji
AU - Fujie, Toshinori
N1 - Funding Information:
This work was supported by the Institute of Advanced Active Aging Research, Waseda University, Human Performance Laboratory, Waseda University, Research Branding Project, Waseda University and JSPS KAKENHI (Grant Number 17K20116 for T.F.) from MEXT, Japan.
Publisher Copyright:
© 2019 The Japan Society of Applied Physics.
PY - 2019/7/1
Y1 - 2019/7/1
N2 - Development of sinter-free stretchable conductive inks is critically important to expand the range of materials and applications for flexible electronics. However, conventional stretchable conductive inks require high temperature sintering, which may damage the heat-frail substrates. In this study, we developed sinter-free stretchable conductive inks composed of polystyrene-block-polybutadiene-block-polystyrene (SBS) and silver flakes in tetrahydrofuran (THF). The high volatility and polarity of THF induced the densification and alignment of silver flakes in the SBS matrix, where silver flakes with large surface area and high aspect ratio were formed into the multistacked structure, resulting in the increase of conductive pathways in the stretched wiring.
AB - Development of sinter-free stretchable conductive inks is critically important to expand the range of materials and applications for flexible electronics. However, conventional stretchable conductive inks require high temperature sintering, which may damage the heat-frail substrates. In this study, we developed sinter-free stretchable conductive inks composed of polystyrene-block-polybutadiene-block-polystyrene (SBS) and silver flakes in tetrahydrofuran (THF). The high volatility and polarity of THF induced the densification and alignment of silver flakes in the SBS matrix, where silver flakes with large surface area and high aspect ratio were formed into the multistacked structure, resulting in the increase of conductive pathways in the stretched wiring.
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U2 - 10.7567/1882-0786/ab21b8
DO - 10.7567/1882-0786/ab21b8
M3 - Article
AN - SCOPUS:85073661833
SN - 1882-0778
VL - 12
JO - Applied Physics Express
JF - Applied Physics Express
IS - 7
M1 - 075001
ER -