Size-Dependent Filling Behavior of UV-Curable Di(meth)acrylate Resins into Carbon-Coated Anodic Aluminum Oxide Pores of around 20 nm

Ultraviolet (UV) nanoimprint lithography is a promising nanofabrication technology with cost efficiency and high throughput for sub-20 nm size semiconductor, data storage, and optical devices. To test formability of organic resist mask patterns, we investigated whether the type of polymerizable di(meth)acrylate monomer affected the fabrication of cured resin nanopillars by UV nanoimprinting using molds with pores of around 20 nm. We used carbon-coated, porous, anodic aluminum oxide (AAO) films prepared by electrochemical oxidation and thermal chemical vapor deposition as molds, because the pore diameter distribution in the range of 10-40 nm was suitable for combinatorial testing to investigate whether UV-curable resins comprising each monomer were filled into the mold recesses in UV nanoimprinting. Although the UV-curable resins, except for a bisphenol A-based one, detached from the molds without pull-out defects after radical photopolymerization under UV light, the number of cured resin nanopillars was independent of the viscosity of the monomer(s) in each resin. The number of resin nanopillars increased and their diameter decreased as the number of hydroxy groups in the aliphatic diacrylate monomers increased. It was concluded that the filling of the carbon-coated pores having diameters of around 20 nm with UV-curable resins was promoted by the presence of hydroxy groups in the aliphatic di(meth)acrylate monomers.