Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis

Hiroshi Hashimoto, Mizuki Nakajima, Seiichi Kawata, Sang Gyu Shin, Toshiyuki Murao

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    In this paper, we propose an objective skill level evaluation method for Taijiquan. The proposed skill level evaluation method utilizes a logarithmic distribution diagram of curvature for spiral arm motion and a cross-correlation for whole body motoion. In order to demonstrate a possibility of the proposed method, we present experimental results with a Kinect sensor.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE International Conference on Industrial Technology
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages712-717
    Number of pages6
    ISBN (Print)9781479939398
    DOIs
    Publication statusPublished - 2014 Sep 9
    Event2014 IEEE International Conference on Industrial Technology, ICIT 2014 - Busan
    Duration: 2014 Feb 262014 Mar 1

    Other

    Other2014 IEEE International Conference on Industrial Technology, ICIT 2014
    CityBusan
    Period14/2/2614/3/1

    Fingerprint

    Sensors
    Motion analysis

    Keywords

    • cross-correlation
    • logarithmic distribution diagram
    • skill level evaluation
    • Taijiquan

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Science Applications

    Cite this

    Hashimoto, H., Nakajima, M., Kawata, S., Shin, S. G., & Murao, T. (2014). Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis. In Proceedings of the IEEE International Conference on Industrial Technology (pp. 712-717). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIT.2014.6895019

    Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis. / Hashimoto, Hiroshi; Nakajima, Mizuki; Kawata, Seiichi; Shin, Sang Gyu; Murao, Toshiyuki.

    Proceedings of the IEEE International Conference on Industrial Technology. Institute of Electrical and Electronics Engineers Inc., 2014. p. 712-717.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Hashimoto, H, Nakajima, M, Kawata, S, Shin, SG & Murao, T 2014, Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis. in Proceedings of the IEEE International Conference on Industrial Technology. Institute of Electrical and Electronics Engineers Inc., pp. 712-717, 2014 IEEE International Conference on Industrial Technology, ICIT 2014, Busan, 14/2/26. https://doi.org/10.1109/ICIT.2014.6895019
    Hashimoto H, Nakajima M, Kawata S, Shin SG, Murao T. Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis. In Proceedings of the IEEE International Conference on Industrial Technology. Institute of Electrical and Electronics Engineers Inc. 2014. p. 712-717 https://doi.org/10.1109/ICIT.2014.6895019
    Hashimoto, Hiroshi ; Nakajima, Mizuki ; Kawata, Seiichi ; Shin, Sang Gyu ; Murao, Toshiyuki. / Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis. Proceedings of the IEEE International Conference on Industrial Technology. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 712-717
    @inproceedings{d219074ee02c4f06ad87826bc247161a,
    title = "Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis",
    abstract = "In this paper, we propose an objective skill level evaluation method for Taijiquan. The proposed skill level evaluation method utilizes a logarithmic distribution diagram of curvature for spiral arm motion and a cross-correlation for whole body motoion. In order to demonstrate a possibility of the proposed method, we present experimental results with a Kinect sensor.",
    keywords = "cross-correlation, logarithmic distribution diagram, skill level evaluation, Taijiquan",
    author = "Hiroshi Hashimoto and Mizuki Nakajima and Seiichi Kawata and Shin, {Sang Gyu} and Toshiyuki Murao",
    year = "2014",
    month = "9",
    day = "9",
    doi = "10.1109/ICIT.2014.6895019",
    language = "English",
    isbn = "9781479939398",
    pages = "712--717",
    booktitle = "Proceedings of the IEEE International Conference on Industrial Technology",
    publisher = "Institute of Electrical and Electronics Engineers Inc.",

    }

    TY - GEN

    T1 - Skill level evaluation of Taijiquan based on 3D body motion analysis - Via logalithm distribution diagram and phase analysis

    AU - Hashimoto, Hiroshi

    AU - Nakajima, Mizuki

    AU - Kawata, Seiichi

    AU - Shin, Sang Gyu

    AU - Murao, Toshiyuki

    PY - 2014/9/9

    Y1 - 2014/9/9

    N2 - In this paper, we propose an objective skill level evaluation method for Taijiquan. The proposed skill level evaluation method utilizes a logarithmic distribution diagram of curvature for spiral arm motion and a cross-correlation for whole body motoion. In order to demonstrate a possibility of the proposed method, we present experimental results with a Kinect sensor.

    AB - In this paper, we propose an objective skill level evaluation method for Taijiquan. The proposed skill level evaluation method utilizes a logarithmic distribution diagram of curvature for spiral arm motion and a cross-correlation for whole body motoion. In order to demonstrate a possibility of the proposed method, we present experimental results with a Kinect sensor.

    KW - cross-correlation

    KW - logarithmic distribution diagram

    KW - skill level evaluation

    KW - Taijiquan

    UR - http://www.scopus.com/inward/record.url?scp=84907782165&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84907782165&partnerID=8YFLogxK

    U2 - 10.1109/ICIT.2014.6895019

    DO - 10.1109/ICIT.2014.6895019

    M3 - Conference contribution

    SN - 9781479939398

    SP - 712

    EP - 717

    BT - Proceedings of the IEEE International Conference on Industrial Technology

    PB - Institute of Electrical and Electronics Engineers Inc.

    ER -