Sn-Bi added Ag-based transient liquid phase sintering for low temperature bonding

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    2 Citations (Scopus)

    Abstract

    A low temperature and low pressure fluxless bonding of plateless Cu-Cu substrates has been achieved by transient liquid phase sintering of Ag and Sn-Bi eutectic powder mixture in a formic acid reducing environment. The effects of Sn-Bi addition amount and sintering temperature to the shear strength and microstructure were investigated. Remelting temperature of the sintered paste was also examined. Shear strength of 30 weight percentage added Sn-Bi that was sintered at 250°C was over than 20 MPa. The microstructure varied with the Sn-Bi addition amount, however, mainly consisted of Ag solid solution and/or Ag-Sn intermetallic compounds (IMCs), Bi-rich phase and Cu-Sn IMCs. No remelting event at Sn-Bi eutectic temperature was observed and the remelting temperature shifted to approximately 262°C, implying the possibility for higher operation temperature although the processing was performed at lower temperature.

    Original languageEnglish
    Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Number of pages1
    ISBN (Electronic)9784904743034
    DOIs
    Publication statusPublished - 2017 Jun 13
    Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
    Duration: 2017 May 162017 May 18

    Other

    Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    CountryJapan
    CityTokyo
    Period17/5/1617/5/18

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films

    Cite this

    Muhammad, K. F., Yamamoto, T., & Yoshida, M. (2017). Sn-Bi added Ag-based transient liquid phase sintering for low temperature bonding. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947430] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947430