SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics

Tito Pradhono Tomo, Wai Keat Wong, Alexander Schmitz, Harris Kristanto, Sophon Somlor, Jinsun Hwang, Shigeki Sugano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a low cost, easy to produce, small tactile sensor system, that can be embedded in a soft material and limited space. In the current implementation, we use a Hall-effect sensor and a magnet to measure the force. One sensor module can measure 3D force vector and temperature. This chip is planted inside a 55 × 55 × 8 mm of the silicon layer. The module has I2C digital output, requiring only four wires for each module. The experiment shows that the signal to noise ratio (SNR) for this module is relatively high, 21.4658 dB when 20g load is applied. The experiment also indicates that the sensor module measured loads differently depending on the type of material that is in contact.

Original languageEnglish
Title of host publicationSII 2016 - 2016 IEEE/SICE International Symposium on System Integration
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages428-433
Number of pages6
ISBN (Electronic)9781509033294
DOIs
Publication statusPublished - 2017 Feb 6
Externally publishedYes
Event2016 IEEE/SICE International Symposium on System Integration, SII 2016 - Sapporo, Japan
Duration: 2016 Dec 132016 Dec 15

Other

Other2016 IEEE/SICE International Symposium on System Integration, SII 2016
CountryJapan
CitySapporo
Period16/12/1316/12/15

Fingerprint

Force Sensor
Robotics
Signal to noise ratio
Module
Sensors
Modeling
Costs
Sensor
Tactile Sensor
Hall effect
Hall Effect
Magnets
Experiments
Wire
Experiment
Silicon
Chip
Contact
Output
Temperature

ASJC Scopus subject areas

  • Biomedical Engineering
  • Control and Systems Engineering
  • Mechanical Engineering
  • Artificial Intelligence
  • Hardware and Architecture
  • Control and Optimization

Cite this

Tomo, T. P., Wong, W. K., Schmitz, A., Kristanto, H., Somlor, S., Hwang, J., & Sugano, S. (2017). SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics. In SII 2016 - 2016 IEEE/SICE International Symposium on System Integration (pp. 428-433). [7844036] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SII.2016.7844036

SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics. / Tomo, Tito Pradhono; Wong, Wai Keat; Schmitz, Alexander; Kristanto, Harris; Somlor, Sophon; Hwang, Jinsun; Sugano, Shigeki.

SII 2016 - 2016 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc., 2017. p. 428-433 7844036.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tomo, TP, Wong, WK, Schmitz, A, Kristanto, H, Somlor, S, Hwang, J & Sugano, S 2017, SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics. in SII 2016 - 2016 IEEE/SICE International Symposium on System Integration., 7844036, Institute of Electrical and Electronics Engineers Inc., pp. 428-433, 2016 IEEE/SICE International Symposium on System Integration, SII 2016, Sapporo, Japan, 16/12/13. https://doi.org/10.1109/SII.2016.7844036
Tomo TP, Wong WK, Schmitz A, Kristanto H, Somlor S, Hwang J et al. SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics. In SII 2016 - 2016 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc. 2017. p. 428-433. 7844036 https://doi.org/10.1109/SII.2016.7844036
Tomo, Tito Pradhono ; Wong, Wai Keat ; Schmitz, Alexander ; Kristanto, Harris ; Somlor, Sophon ; Hwang, Jinsun ; Sugano, Shigeki. / SNR modeling and material dependency test of a low-cost and simple to fabricate 3D force sensor for soft robotics. SII 2016 - 2016 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 428-433
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