Solder/adhesive bonding using simple planarization technique for 3D integration

Masatsugu Nimura, Jun Mizuno, Katsuyuki Sakuma, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

This paper describes a hybrid solder/adhesive bonding method using a simple planarization technique for three-dimensional (3D) integration. With the hybrid bonding method, the chip bonding and encapsulation of underfill resin between chips is completed in one step. The simple planarization technique is used to planarize adhesive on a flat Si substrate coated with a release agent. The planarization technique is a simple and inexpensive operation compared to the conventional processes using Chemical Mechanical Polishing (CMP) or fly cutting. Since the CMP process has advantages for wafer-level fabrication, we also evaluated hybrid bonding using CMP. The results of the simple planarization process show that the spaces around the Cu/Sn bumps were fully filled with the adhesive, and the adhesive residual layer on the Cu/Sn bumps was removed by O2 plasma. A cross-sectional SEM image after the hybrid bonding using the proposed planarization process shows that the Cu/Sn solder had properly wetted the Au and the adhesive had uniformly filled the small gaps between the bonded chips. Solder/adhesive bonding using CMP was also succeeded. In addition, Au/adhesive bonding with 10-μm pitch Au bumps was realized.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1147-1152
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL
Duration: 2011 May 312011 Jun 3

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CityLake Buena Vista, FL
Period11/5/3111/6/3

Fingerprint

Soldering alloys
Adhesives
Chemical mechanical polishing
Encapsulation
Resins
Plasmas
Fabrication
Scanning electron microscopy
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Nimura, M., Mizuno, J., Sakuma, K., & Shoji, S. (2011). Solder/adhesive bonding using simple planarization technique for 3D integration. In Proceedings - Electronic Components and Technology Conference (pp. 1147-1152). [5898655] https://doi.org/10.1109/ECTC.2011.5898655

Solder/adhesive bonding using simple planarization technique for 3D integration. / Nimura, Masatsugu; Mizuno, Jun; Sakuma, Katsuyuki; Shoji, Shuichi.

Proceedings - Electronic Components and Technology Conference. 2011. p. 1147-1152 5898655.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nimura, M, Mizuno, J, Sakuma, K & Shoji, S 2011, Solder/adhesive bonding using simple planarization technique for 3D integration. in Proceedings - Electronic Components and Technology Conference., 5898655, pp. 1147-1152, 2011 61st Electronic Components and Technology Conference, ECTC 2011, Lake Buena Vista, FL, 11/5/31. https://doi.org/10.1109/ECTC.2011.5898655
Nimura M, Mizuno J, Sakuma K, Shoji S. Solder/adhesive bonding using simple planarization technique for 3D integration. In Proceedings - Electronic Components and Technology Conference. 2011. p. 1147-1152. 5898655 https://doi.org/10.1109/ECTC.2011.5898655
Nimura, Masatsugu ; Mizuno, Jun ; Sakuma, Katsuyuki ; Shoji, Shuichi. / Solder/adhesive bonding using simple planarization technique for 3D integration. Proceedings - Electronic Components and Technology Conference. 2011. pp. 1147-1152
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