Solder/adhesive bonding using simple planarization technique for 3D integration

Masatsugu Nimura, Jun Mizuno, Katsuyuki Sakuma, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Solder/adhesive bonding using simple planarization technique for 3D integration'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science