Sorting-based I/O connection assignment and non-Manhattan RDL routing for flip-chip designs

Research output: Contribution to journalArticle

Abstract

In modern VLSI designs, a flip-chip package is widely used to meet the higher integration density and the larger I/O counts of circuits. Recently the I/O buffers are mapped onto bump balls without changing the module placement using re-distribution layer (RDL) in flip-chip designs. In this research, a sorting-based I/O connection assignment and non-Manhattan RDL routing method is proposed for area I/O flip-chip designs. The approach initially assigns the I/O buffers to bump balls by sorting the Manhattan distance between them. Three kinds of pair-exchange procedures are then carried out to improve the initial assignment. Then to shorten the wire length, non-Manhattan RDL routing is adopted to connect the I/O buffers and bump balls. Finally some un-routed connections are ripped up and rerouted. The experimental results show that the proposed method is able to obtain the routes with shorter wire length in reasonable CPU times.

Original languageEnglish
Pages (from-to)1535-1544
Number of pages10
JournalIEEJ Transactions on Electronics, Information and Systems
Volume135
Issue number12
DOIs
Publication statusPublished - 2015 Dec 1

Fingerprint

Sorting
Wire
Program processors
Networks (circuits)

Keywords

  • Flip-chip designs
  • I/O connection assignment
  • RDL routing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sorting-based I/O connection assignment and non-Manhattan RDL routing for flip-chip designs. / Zhang, Ran; Watanabe, Takahiro.

In: IEEJ Transactions on Electronics, Information and Systems, Vol. 135, No. 12, 01.12.2015, p. 1535-1544.

Research output: Contribution to journalArticle

@article{10e5461c4d164ef285c40398810098f4,
title = "Sorting-based I/O connection assignment and non-Manhattan RDL routing for flip-chip designs",
abstract = "In modern VLSI designs, a flip-chip package is widely used to meet the higher integration density and the larger I/O counts of circuits. Recently the I/O buffers are mapped onto bump balls without changing the module placement using re-distribution layer (RDL) in flip-chip designs. In this research, a sorting-based I/O connection assignment and non-Manhattan RDL routing method is proposed for area I/O flip-chip designs. The approach initially assigns the I/O buffers to bump balls by sorting the Manhattan distance between them. Three kinds of pair-exchange procedures are then carried out to improve the initial assignment. Then to shorten the wire length, non-Manhattan RDL routing is adopted to connect the I/O buffers and bump balls. Finally some un-routed connections are ripped up and rerouted. The experimental results show that the proposed method is able to obtain the routes with shorter wire length in reasonable CPU times.",
keywords = "Flip-chip designs, I/O connection assignment, RDL routing",
author = "Ran Zhang and Takahiro Watanabe",
year = "2015",
month = "12",
day = "1",
doi = "10.1541/ieejeiss.135.1535",
language = "English",
volume = "135",
pages = "1535--1544",
journal = "IEEJ Transactions on Electronics, Information and Systems",
issn = "0385-4221",
publisher = "The Institute of Electrical Engineers of Japan",
number = "12",

}

TY - JOUR

T1 - Sorting-based I/O connection assignment and non-Manhattan RDL routing for flip-chip designs

AU - Zhang, Ran

AU - Watanabe, Takahiro

PY - 2015/12/1

Y1 - 2015/12/1

N2 - In modern VLSI designs, a flip-chip package is widely used to meet the higher integration density and the larger I/O counts of circuits. Recently the I/O buffers are mapped onto bump balls without changing the module placement using re-distribution layer (RDL) in flip-chip designs. In this research, a sorting-based I/O connection assignment and non-Manhattan RDL routing method is proposed for area I/O flip-chip designs. The approach initially assigns the I/O buffers to bump balls by sorting the Manhattan distance between them. Three kinds of pair-exchange procedures are then carried out to improve the initial assignment. Then to shorten the wire length, non-Manhattan RDL routing is adopted to connect the I/O buffers and bump balls. Finally some un-routed connections are ripped up and rerouted. The experimental results show that the proposed method is able to obtain the routes with shorter wire length in reasonable CPU times.

AB - In modern VLSI designs, a flip-chip package is widely used to meet the higher integration density and the larger I/O counts of circuits. Recently the I/O buffers are mapped onto bump balls without changing the module placement using re-distribution layer (RDL) in flip-chip designs. In this research, a sorting-based I/O connection assignment and non-Manhattan RDL routing method is proposed for area I/O flip-chip designs. The approach initially assigns the I/O buffers to bump balls by sorting the Manhattan distance between them. Three kinds of pair-exchange procedures are then carried out to improve the initial assignment. Then to shorten the wire length, non-Manhattan RDL routing is adopted to connect the I/O buffers and bump balls. Finally some un-routed connections are ripped up and rerouted. The experimental results show that the proposed method is able to obtain the routes with shorter wire length in reasonable CPU times.

KW - Flip-chip designs

KW - I/O connection assignment

KW - RDL routing

UR - http://www.scopus.com/inward/record.url?scp=84948770585&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84948770585&partnerID=8YFLogxK

U2 - 10.1541/ieejeiss.135.1535

DO - 10.1541/ieejeiss.135.1535

M3 - Article

AN - SCOPUS:84948770585

VL - 135

SP - 1535

EP - 1544

JO - IEEJ Transactions on Electronics, Information and Systems

JF - IEEJ Transactions on Electronics, Information and Systems

SN - 0385-4221

IS - 12

ER -