Stress-free stretchable electronic device using folding deformation

Yoshitaka Iwata, Eiji Iwase

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Citations (Scopus)

    Abstract

    We developed a two-dimensionally (2-D) stretchable electronic device with stress-free region by applying origami folding. The key idea is to achieve 'a stretching deformation of whole device' by 'a local bending deformation'. Because our device has stress-free region, we can use a rigid chip (such as LED chips and MEMS sensors) and a metal wire without mechanical fracture or metal fatigue. In this paper, first, we proposed a 2-D stretchable structure by developing 'miura-ori' folding. Next, we fabricated a 2-D stretchable electronic device, and confirmed that wire fatigue or cracks are not generated by repeated deformation. Finally, we demonstrated 2-D stretchability and bendability using the device with inorganic LED chips.

    Original languageEnglish
    Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages231-234
    Number of pages4
    ISBN (Electronic)9781509050789
    DOIs
    Publication statusPublished - 2017 Feb 23
    Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
    Duration: 2017 Jan 222017 Jan 26

    Other

    Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
    CountryUnited States
    CityLas Vegas
    Period17/1/2217/1/26

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Mechanical Engineering
    • Electrical and Electronic Engineering

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  • Cite this

    Iwata, Y., & Iwase, E. (2017). Stress-free stretchable electronic device using folding deformation. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 231-234). [7863383] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863383