Abstract
Silicon carbide has been etched using a combination of high-dose ion implantation and wet chemical etching. Structural properties with respect to the remaining damage after etching have been studied using atomic force microscopy, Rutherford backscattering/channeling, and Raman spectroscopy. No significant deterioration of the crystal quality has been found after the etching process. Moreover, the as-etched surface is characterized by a lower roughness compared to virgin material. The results demonstrate that this etching method can be used for the fabrication of contacts on silicon carbide surfaces.
Original language | English |
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Title of host publication | Materials Science Forum |
Publisher | Trans Tech Publ Ltd |
Volume | 338 |
Publication status | Published - 2000 |
Externally published | Yes |
Event | ICSCRM '99: The International Conference on Silicon Carbide and Related Materials - Research Triangle Park, NC, USA Duration: 1999 Oct 10 → 1999 Oct 15 |
Other
Other | ICSCRM '99: The International Conference on Silicon Carbide and Related Materials |
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City | Research Triangle Park, NC, USA |
Period | 99/10/10 → 99/10/15 |
ASJC Scopus subject areas
- Materials Science(all)