Structure change and improvement of the mechanical properties of lotus-type porous copper by ECAE process

Juan Lobos, Shinsuke Suzuki, Hiroshi Utsunomiya, Hideo Nakajima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Deformation behavior of lotus-type porous copper with long cylindrical pores aligned in one direction through equal-channel angular extrusion (ECAE) process was investigated using a die with channel angle of 150°. Although the density slightly increased after every pass, the porous structure remains in the process. The Vickers hardness and the compressive yield strength of lotus copper increased through the ECAE process. The compressive yield strength after 3 passes increased up to 10 times larger than that before processing. The deformation of lotus copper takes place by buckling and the shearing of the cell walls. The increase in hardness is considered to be caused by work hardening.

Original languageEnglish
Title of host publication10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009
Pages757-760
Number of pages4
DOIs
Publication statusPublished - 2009 Sep 30
Event10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009 - Xian, China
Duration: 2009 Jan 132009 Jan 15

Publication series

NameMaterials Science Forum
Volume620 622
ISSN (Print)0255-5476

Conference

Conference10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009
CountryChina
CityXian
Period09/1/1309/1/15

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Keywords

  • ECAE
  • Lotus copper
  • Porous metals
  • Severe plastic deformation
  • Vickers hardness
  • Yield strength

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lobos, J., Suzuki, S., Utsunomiya, H., & Nakajima, H. (2009). Structure change and improvement of the mechanical properties of lotus-type porous copper by ECAE process. In 10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009 (pp. 757-760). (Materials Science Forum; Vol. 620 622). https://doi.org/10.4028/www.scientific.net/MSF.620-622.757