Studies on SiO2-SiO2 bonding with hydrofluoric acid - room temperature and low stress bonding technique for MEMS

H. Nakanishi, T. Nishimoto, R. Nakamura, A. Yotsumoto, S. Shoji

Research output: Contribution to conferencePaperpeer-review

19 Citations (Scopus)

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Engineering & Materials Science